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E-band cavity diplexer based on micromachined technology

Published online by Cambridge University Press:  12 January 2015

Valeria Nocella ,
Luca Pelliccia ,
Paola Farinelli ,
Roberto Sorrentino ,
Mario Costa ,
Dai Yufeng  and
Zhou Yanzhao
Valeria Nocella
Affiliation:
Department of Engineering, University of Perugia, Via G. Duranti 93, Perugia, Italy
Luca Pelliccia*
Affiliation:
RF Microtech Srl, Via P. Mascagni 11, Perugia, Italy. Phone: + 39 075 527 1436
Paola Farinelli
Affiliation:
RF Microtech Srl, Via P. Mascagni 11, Perugia, Italy. Phone: + 39 075 527 1436
Roberto Sorrentino
Affiliation:
Department of Engineering, University of Perugia, Via G. Duranti 93, Perugia, Italy
Mario Costa
Affiliation:
Huawei Technologies Italia Srl, Segrate (MI), Italy
Dai Yufeng
Affiliation:
Huawei Technologies Italia Srl, Segrate (MI), Italy
Zhou Yanzhao
Affiliation:
Huawei Technologies Italia Srl, Segrate (MI), Italy
*
Corresponding author:L. Pelliccia Email: [email protected]
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Abstract

A robust and tuneless micromachined waveguide diplexer operating in the frequency range 71–86 GHz is here presented. The diplexer is based on multiple coupled cavities and it is manufactured using micromachining technology on two staked silicon layers. The diplexer consists of two filters combined to a common waveguide port via an E-plane T-junction. The two eight-order band-pass filters are centered at 73.5 and 83.5 GHz. The fractional bandwidths for two bands are 8.8 and 7.8% at higher- and lower-band, respectively. The measured insertion loss is below 0.7 dB for both the filters and the diplexer isolation is better than 55 dB, as required. The proposed technology allows for a very compact device (<20 × 20 × 1.5 mm) and the first prototypes were proved to be very robust to manufacturing tolerances and environmental tests, thus leading to an excellent tuneless manufacturing yield in future production. The diplexer will be employed in next generation terrestrial radio-link communications front-ends.

Keywords

FiltersNew and emerging technologies and materials
Type
Research Paper
Information
International Journal of Microwave and Wireless Technologies , Volume 8 , Issue 2 , March 2016 , pp. 179 - 184
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2015 

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References

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