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An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects

Published online by Cambridge University Press:  15 September 2010

Brian Curran ,
Ivan Ndip ,
Christian Werner ,
Veronika Ruttkowski ,
Marcus Maiwald ,
Heinrich Wolf ,
Volker Zoellmer ,
Gerhard Domann ,
Stephan Guttovski  and
Horst Gieser
...Show all authors
Brian Curran*
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany.
Ivan Ndip
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany.
Christian Werner
Affiliation:
Fraunhofer Institute for Manufacturing Technology and Applied Materials Research, Wiener Straße 12, 28359, Bremen, Germany.
Veronika Ruttkowski
Affiliation:
Fraunhofer Institute for Manufacturing Technology and Applied Materials Research, Wiener Straße 12, 28359, Bremen, Germany.
Marcus Maiwald
Affiliation:
Fraunhofer Institute for Manufacturing Technology and Applied Materials Research, Wiener Straße 12, 28359, Bremen, Germany.
Heinrich Wolf
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany.
Volker Zoellmer
Affiliation:
Fraunhofer Institute for Manufacturing Technology and Applied Materials Research, Wiener Straße 12, 28359, Bremen, Germany.
Gerhard Domann
Affiliation:
Fraunhofer Institute for Silicate Research, Neunerplatz 2, D-97082 Würzburg.
Stephan Guttovski
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany.
Horst Gieser
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany.
Herbert Reichl
Affiliation:
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany. Technische Universität Berlin, Strasse des 17. Juli 135, 10623 Berlin, Germany.
*
Corresponding author: B. Curran Email: [email protected]
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Abstract

New technologies have resulted in transmission lines that deviate significantly from the intended rectangular cross sections. Trapezoidal cross sections and roughness that penetrate a significant depth into the surface in comparison to the skin-depth of the conductor can cause a very significant deviation in transmission line parameters from predicted values. Proximity effect further complicates the analysis by increasing losses and changing the impact of surface roughness by changing the current distribution. A skin-effect filament model that combines a traditional skin-effect filament modeling concept with traditional surface roughness modeling concepts is presented that accounts for surface roughness effects and non-ideal cross sections. The new technique models the transmission line non-idealities in a combined way with the current density in the signal and return current paths. This adapted filament model shows an average deviation of less than 2% above 1 GHz with one given transmission line measurement and does not have the computational challenges seen in a 3D full-wave solver.

Keywords

Skin-effect modelingProximity effectSurface roughnessEdge effectsConductor modeling
Type
Original Article
Information
International Journal of Microwave and Wireless Technologies , Volume 2 , Special Issue 3-4: European Microwave Week 2009 , August 2010 , pp. 273 - 281
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2010

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References

REFERENCES

[1]Wheeler, H.A.: Formulas for the skin effect, Proc. IRE, 30(9) (1942), 412–424.Google Scholar
[2]Pucel, R.A.; Masse, D.J.; Hartwig, C.P.: Losses in microstrip. IEEE Trans. Microw. Theory Tech., 16(6) (1968), 342–350.Google Scholar
[3]He, J.; Nahman, N.S.; Riad, S.M.: A causal skin-effect model of microstrip lines, Microwave Symposium Digest, 1993, IEEE MTT-S International, 2 (1993), 865–868.Google Scholar
[4]Gupta, K.C.; Garg, R.; Chadha, R.: Computer Aided Design of Microwave Circuits, Artech House, Norwood, MA, 1981.Google Scholar
[5]Vu Dinh, T.; Cabon, B.; Chilo, J.: New skin-effect equivalent circuit. Electron. Lett., 26(19) (1990), 1582–1584.Google Scholar
[6]Vu Dinh, T.Vu.; Cabon, B.; Chilo, J.: Time domain analysis of skin effect on lossy interconnections, Electron. Lett., 26(25) (1990), 2057–2058.Google Scholar
[7]Weeks, W.T.; Wu, L.L.; McAllister, M.F.; Singh, A.: Resistive and inductive skin effect in rectangular conductors. IBM J. Res. Develop., 23(6) (1979), 652–660.Google Scholar
[8]Coperich, K.M.; Ruehli, A.E.; Cangellaris, A.: Enhanced skin effect for partial-element equivalent-circuit (PEEC) models, IEEE Trans. Microw. Theory Tech., 48(9) (2000), 1435–1442.CrossRefGoogle Scholar
[9]Mei, S.; Amin, C.; Ismail, Y.I.: Efficient model order reduction including skin effect, in Proc. Design Automation Conf., Anaheim, California, USA, June 2–6, 2003, 232–237.Google Scholar
[10]Mei, S.; Ismail, Y.I.: Modeling skin and proximity effects with reduced realizable RL circuits, IEEE Trans. Very Large Scale Integr. (VLSI) Syst., 12(4) (2004), 437–447.Google Scholar
[11]Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.: On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections, Presented at IEEE EMC Symp. 2009, Austin, TX, USA, August 2009.Google Scholar
[12]Hammerstad, J.: Accurate models for microstrip computer aided design, IEEE MTT-S Int. Microwave Symp., Dig., May 1980, 407–409.Google Scholar
[13]Groiss, S.; Bardi, I.; Biro, O.; Preis, K.; Richter, K.: Parameters of lossy cavity resonators calculated by the finite element method. IEEE Trans. Magn., 32(3) (1996), 894–897.CrossRefGoogle Scholar
[14]Hall, S. et al. : Multigigahertz causal transmission line modeling methodology using a 3-D hemispherical surface roughness approach. IEEE Trans. Microw. Theory Tech., 55(12) Part 1 (2007), 2614–2624.Google Scholar
[15]Lukic, M.V.; Filipovic, D.S.: Modeling of 3-D surface roughness effects with application to µ-coaxial lines. IEEE Trans. Microw. Theory Tech., 55(3) (2007), 518–525.Google Scholar
[16]Chen, X.: EM modeling of microstrip conductor losses including surface roughness effect. IEEE Microw. Wireless Compon. Lett., 17(2) (2007), 94–96.CrossRefGoogle Scholar
[17]Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.: On the quantification and improvement of the models for surface roughness, Presented at IEEE Workshop on Signal Propagation on Interconnects, SPI'09, Strasbourg, France, May 2009.Google Scholar
[18]Curran, B.; Ndip, I.; Guttowski, S.; Recihl, H.: Modeling and measurement of coplanar transmission lines with significant proximity and surface roughness effects, Presented at European Microwave Conf., EuMC, Rome, October 2009.Google Scholar
[19]Zöllmer, V. et al. : Printing with aerosols – a maskless deposition technique allows high definition printing of a variety of functional materials. Eur. Coat. J., 7–8 (2006), 46–50.Google Scholar
[20]Wadell, B.C.: Transmission Line Handbook, Chapters 3 and 4, Artech House, Norwood, MA, 1991.Google Scholar