Hostname: page-component-cd9895bd7-hc48f Total loading time: 0 Render date: 2024-12-25T03:02:37.141Z Has data issue: false hasContentIssue false
  • English
  • Français

Novel electromagnetic bandgap structure to mitigate simultaneous switching noise for mixed-signal system applications

Published online by Cambridge University Press:  17 February 2016

Vasudevan Karuppiah  and
Raju Srinivasan
Vasudevan Karuppiah*
Affiliation:
Departrment of Electronics and Communication Engineering, Thiagarajar College of Engineering, Madurai, Tamilnadu, India. Phone: +91 9488961121
Raju Srinivasan
Affiliation:
Departrment of Electronics and Communication Engineering, Thiagarajar College of Engineering, Madurai, Tamilnadu, India. Phone: +91 9488961121
*
Corresponding author: K. Vasudevan Email: [email protected]
Get access Rights & Permissions [Opens in a new window]

Abstract

This paper proposes a novel T-shape electromagnetic bandgap (EBG) structure to suppress simultaneous switching noise (SSN) in mixed-signal systems. Noise is generated due to simultaneous switching multiple drivers in the digital ICs. It is called as SSN. It could propagate between power and ground planes of underlying PCB platform and interfere with the functionality of nearby RF/Analog ICs. So, the RF modules are isolated from the digital module for proper functioning of entire mixed-signal system. A high-impedance surface, called T-shape EBG has been implemented between digital and RF modules. It will exhibit the characteristics of bandgap for a wide frequency range to suppress the propagation of switching noise. A single unit-cell of T-EBG is periodically patterned over one side of the PCB and the other side is kept continuous. In this paper different characteristics of T-EBG have been simulated and verified with the measurement results. A 3 × 3 T-EBG layout provides an isolation of −40 dB from 0.72 to 6.39 GHz. A scaled version of T-EBG is used to shift the bandgap towards higher frequency range from 2.22 to 7.19 GHz. Also, a novel layout methodology has been proposed to broaden the bandgap from 2.02 to 18.84 GHz without reducing the thickness of dielectric substrate.

Keywords

Characterization of Material ParametersHybrid and Multi-Chip ModulesElectromagnetic Bandgap Structures
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 9 , Issue 2 , March 2017 , pp. 299 - 306
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Swaminathan, M.; Ege Engin, A.: Power Integrity Modeling and Design for Semiconductors and Systems, Prentice-Hall, Englewood Cliffs, NJ, 2007.Google Scholar
[2] Van Den Berghe, S.; Olyslager, F.; De Zutter, D.; De Moerloose, J.; Temmerman, W.: Study of the ground bounce caused by power plane resonances. IEEE Trans. Electromagn. Compatibility, 40 (2) (1998), 111–119.Google Scholar
[3] Hubing, T.H.; Drewniak, J.L.; Van Doren, T.P.; Hockanson, D.M.: Power bus decoupling on multilayer printed circuit boards. IEEE Trans. Electromagn. Compatibility, 37 (2) (1995), 155–166.Google Scholar
[4] Fan, J.; Drewniak, J.L.; Knighten, J.L.; Smith, N.W.; Orlandi, A.; Van Doren, T.P.; Hubing, T.H.; DuBroff, R.E.: Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs. IEEE Trans. Electromagn., Compatibility, 43 (4) (2001), 588–599.Google Scholar
[5] Fan, J.; Cui, W.; Drewniak, J.L.; Van Doren, T.P.; Knighten, J.L.: Estimating the noise mitigation effect of local decoupling in printed circuit boards. IEEE Trans. Adv. Packag., 25 (2) (2002), 154–165.Google Scholar
[6] Chen, J.; Hubing, T.H.; VanDoren, T.P.; DuBroff, R.E.: Power bus isolation using power islands in printed circuit boards. IEEE Trans. Electromagn. Compatibility, 44 (2) (2002), 373–380.Google Scholar
[7] Wei, C.; Jun, F.; Yong, R.; Hao, S.; Drewniak, J.L.; DuBroff, R.E.: DC power bus noise isolation with power-plane segmentation. IEEE Trans. Electromagn. Compatibility, 45 (2) (2003), 436–443.Google Scholar
[8] Wu, T.L.; Chen, S.T.; Hwang, J.N.; Lin, Y.H.: Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB. IEEE Trans. Electromagn. Compatibility, 46 (1) (2004), 33–45.Google Scholar
[9] Lee, J.; Rotaru, M.D.; Iyer, M.K.; Kim, H.; Kim, J.: Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs. IEEE Trans. Adv. Packag., 28 (2) (2005), 298–309.Google Scholar
[10] Kim, T.H.; Lee, J.; Kim, H.; Kim, J.: 3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB, in Proc. IEEE Electr. Perform. Electron. Packag., (2002), 217–220.Google Scholar
[11] Abhari, R.; Eleftheriades, G.V.: Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits. IEEE Trans. Microw. Theory Tech., 51 (6) (2003), 1629–1639.Google Scholar
[12] Shahparnia, S.; Ramahi, O.M.: Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures. IEEE Trans. Electromagn. Compatibility, 46 (4) (2004), 580–587.Google Scholar
[13] Kamgaing, T.; Ramahi, O.M.: Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes. IEEE Trans. Electromagn. Compatibility, 47 (3) (2005), 479–489.Google Scholar
[14] Chen, G.; Melde, K.L.: Cavity resonance suppression in power DeliverySystems using electromagnetic band gap structures. IEEE Trans. Adv. Packag., 29 (1) (2006), 21–30.Google Scholar
[15] Wang, T.-K.; Han, T.-W.; Wu, T.-L.: A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression. IEEE Trans. Microw. Theory Tech., 56 (5) (2008), 1164–1171.Google Scholar
[16] Wang, T.-K.; Hsieh, C.-Y.; Chuang, H.-H.; Wu, T.-L.: Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression. IEEE Trans. Microw. Theory Tech., 57 (8) (2009), 2047–2054.Google Scholar
[17] Wu, T.-L.; Lin, Y.-H.; Wang, T.-K.; Wang, C.-C.; Chen, S.-T.: Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits. IEEE Trans. Microw. Theory Tech., 53 (9) (2005), 2935–2942.Google Scholar
[18] Wu, T.-L.; Wang, C.-C.; Lin, Y.-H.; Wang, T.-K.; Chang, G.: A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits. IEEE Microw. Wireless Compon. Lett., 15 (3) (2005), 174–176.Google Scholar
[19] Lee, J.; Kim, H.; Kim, J.: High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions. IEEE Microw. Wireless Compon. Lett., 15 (8) (2005), 505–507.Google Scholar
[20] Joo, S.-H.; Kim, D.-Y.; Lee, H.-Y.: A S-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise. IEEE Microw. Wireless Compon. Lett., 17 (10) (2007), 709–711.Google Scholar
[21] Mohajer-Iravani, B.; Ramahi, O.M.: Suppression of EMI and electromagnetic noise in packages using embedded capacitance and miniaturized electromagnetic bandgap structures with high-k dielectrics. IEEE Trans. Adv. Packag., 30 (4) (2007), 776–788.Google Scholar
[22] Qin, J.; Ramahi, O.M.; Granatstein, V.: Novel planar electromagnetic bandgap structures for mitigation of switching noise and EMI reduction in high-speed circuits. IEEE Trans. Electromagn. Compatibility, 49 (3) (2007), 661–669.Google Scholar
[23] Kim, K.H.; Schutt-Aine, J.E.: Analysis and modeling of hybrid planar-type electromagnetic bandgap structures and feasibility study on power distribution network applications. IEEE Trans. Microw. Theory Tech., 56 (1) (2008), 178–186.Google Scholar
[24] Li, L.; Chen, Q.; Yuan, Q.; Sawaya, K.: Ultrawideband suppression of ground bounce noise in multilayer PCB using locally embedded planar electromagnetic band-gap structures. IEEE Antennas Wireless Propag. Lett., 8 (2009), 740–743.Google Scholar
[25] Choi, J.; Govind, V.; Swaminathan, M.; Bharath, K.: Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN). IEEE Trans. Adv. Packag., 33 (1) (2010), 2–12.Google Scholar
[26] Rao, P.H.; Swaminathan, M.: A novel compact electromagnetic bandgap structure in power plane for wideband noise suppression and low radiation. IEEE Trans. Electromagn. Compatibility, 53 (4) (2011), 996–1004.Google Scholar
[27] Bait-Suwailam, M.M.; Ramahi, O.M.: Ultrawideband mitigation of simultaneous switching noise and EMI reduction in high-speed PCBs using complementary split-ring resonators. IEEE Trans. Electromagn. Compatibility, 54 (2) (2012), 389–396.Google Scholar
[28] Shi, L.-F.; Zhou, D.-L.: Selectively embedded electromagnetic bandgap structure for suppression of simultaneous switching noise. IEEE Trans. Electromagn. Compatibility, 56 (6) (2014), 1370–1376.Google Scholar
[29] Computer Simulation Technology. (2014). CST Studio Suite [Online]. Available: http://www.cst.com/ Google Scholar