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A novel defect ground structure for decoupling closely spaced E-plane microstrip antenna array

Published online by Cambridge University Press:  31 May 2019

Zicheng Niu ,
Hou Zhang ,
Qiang Chen  and
Tao Zhong
Zicheng Niu*
Affiliation:
Air Force Engineering University, Xi'an, China
Hou Zhang
Affiliation:
Air Force Engineering University, Xi'an, China
Qiang Chen
Affiliation:
Air Force Engineering University, Xi'an, China
Tao Zhong
Affiliation:
Air Force Engineering University, Xi'an, China
*
Author for correspondence: Zicheng Niu, E-mail: [email protected]
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Abstract

In this paper, a novel decoupling technique for closely spaced E-plane patch antennas using defect ground structure (DGS) is proposed. The electric field coupling between the antennas is suppressed by etching DGS which consists of a pair of rectangular slots and four stubs on the ground plane. Moreover, unlike the other methods, the DGS is not etched in the middle of the antennas but loaded along the outer edge of the radiated patch. Thus, through the adopted technology the distance between the antenna elements is reduced and the isolation is increased. To validate the improvements by adopting the proposed technology, the array with DGS loading has been fabricated and then measured. The measurement results show that designed antennas have 95 MHz 10-dB impedance bandwidth, which is 25 MHz higher than that of the antenna without DGS. More importantly, isolation improvements have been increased from 8.5 to 31.3 dB by using the decoupling technique when the antennas are placed with a 0.032 λ0 edge-to-edge distance, where λ0 is the free-space wavelength. Therefore, this technique can be widely applied to improve isolation in a compact and low profile antenna system.

Keywords

Closely spaced antennadefect ground structureE-plane microstrip antennaisolation enhancementmutual coupling
Type
Industrial and Engineering Paper
Information
International Journal of Microwave and Wireless Technologies , Volume 11 , Issue 10 , December 2019 , pp. 1069 - 1074
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2019 

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