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Coherent J-Band radiating arrays based on ×27 CMOS activemultiplier chips

Published online by Cambridge University Press:  03 May 2019

Roman Klimovich Open the ORCID record for Roman Klimovich [Opens in a new window] ,
Samuel Jameson  and
Eran Socher
Roman Klimovich*
Affiliation:
The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, High Frequency Integrated Circuits Lab, School of Electrical Engineering, Physical Electronics, Ramat Aviv, Tel Aviv 69978, Israel
Samuel Jameson
Affiliation:
The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, High Frequency Integrated Circuits Lab, School of Electrical Engineering, Physical Electronics, Ramat Aviv, Tel Aviv 69978, Israel
Eran Socher
Affiliation:
The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, High Frequency Integrated Circuits Lab, School of Electrical Engineering, Physical Electronics, Ramat Aviv, Tel Aviv 69978, Israel
*
Author for correspondence: Roman Klimovich E-mail: [email protected]
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Abstract

This paper presents a hybrid design of 1 × 2 and 1 × 4 arrays operating in 0.277–0.292 THz on 65 nm Complementary metal–oxide–semiconductor (CMOS) technology. Each of the chips has an X-band input with 3 ×3 multiplier stages and connected at the output to an on-chip ring antenna. A wideband microstrip Wilkinson four-way and two-way power dividers have been developed on a multilayer printed circuit board to feed the array elements with proper radio frequency and direct current inputs. Demonstrating improvements in effective isotropically radiated power and in total radiated power compared to a single CMOS element, the hybrid integration approach proves effective in implementing coherent THz transmitter arrays. Theoretical and practical factors that reduce the radiated power compared with ideal arrays are also discussed.

Keywords

Active Array Antennas and ComponentsCircuit Design and ApplicationsHybrid and Multi-Chip Modules
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 11 , Issue 8 , October 2019 , pp. 747 - 754
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2019 

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