Hostname: page-component-cd9895bd7-mkpzs Total loading time: 0 Render date: 2024-12-24T02:27:57.192Z Has data issue: false hasContentIssue false
  • English
  • Français

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Published online by Cambridge University Press:  05 June 2013

M. Catelani ,
V.L. Scarano  and
R. Berni
M. Catelani
Affiliation:
University of Florence, Department of Electronics and Telecommunications, Via S. Marta 3, 50139 Florence, Italy
V.L. Scarano*
Affiliation:
University of Florence, Department of Electronics and Telecommunications, Via S. Marta 3, 50139 Florence, Italy
R. Berni
Affiliation:
University of Florence, Department of Statistics, Viale Morgagni 59, 50134 Florence, Italy
*
⋆ Correspondence: [email protected]
Get access

Abstract

Understanding the ageing of materials for electronic application is a complex challenge, in particular for composite material as electrically conductive adhesive consisting of a nonconductive polymer binder and conductive filler particles. This research involves a large amount of parameters related to both operating conditions and material structure, which act together. Accelerated testing, with the aim to consume rapidly lifetime without inducing incorrect failure mechanisms, is difficult to optimize and its modelling to describe the ageing process is a challenge. To reach this aim could be interesting for the characterization of the material but above all for the general validity of the proposed methodology.

Keywords

Accelerated life testingageingelectrically conductive adhesiveexperimental designlifetime data
Type
Research Article
Information
International Journal of Metrology and Quality Engineering , Volume 4 , Issue 1 , 2013 , pp. 47 - 54
Copyright
© EDP Sciences 2013

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

W. Li, R.C. Feng, Highly Accelerated Life Test for the Reliability Assessment of the Lead-Free SMT Mainboard, Int. Microsystems Pack, Assembly Conf. (2006), pp. 1–4
V. Venkatadri, Y. Liang, X. Yan, E. Cotts, K. Srihari, P. Borgesen, Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion, Electronic Comp. Technol. Conf. (2009), pp. 398–405
F.X. Che, H.L.J. Pang, F.L. Wong, G.H. Lim, T.H. Low, Vibration fatigue test and analysis for flip chip solder joints, Electronics Pack. Technol. Conf. (2003), pp. 107–113
T. Eckert, W.H. Muller, N.F. Nissen, H. Reichl, A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments, Electronic Comp. Technol. Conf. (2009), pp. 522–528
Qi, H., Osterman, M., Pecht, M., Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach, IEEE Trans. Adv. Pack. 31, 463–472 (2008) CrossRefGoogle Scholar
Li, Y., Wong, C.P., Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications, Mater. Sci. Eng. 51, 1–35 (2006) CrossRefGoogle Scholar
Leon, R.V., Ramachandran, R., Ashby, A.J., Thyagarajan, J., Bayesian modelling of accelerated life tests with random effects, J. Qual. Technol. 39, 1–14 (2006) Google Scholar
Freeman, L.J., Vining, G.G., Reliability data analysis for life tests experiments with subsampling, J. Qual. Technol. 42, 233–241 (2010) Google Scholar
W.B. Nelson, Accelerated Testing: Statistical Models, Test Plans, and Data Analysis (Wiley-Interscience Paperback Series, NJ, 2004)
Catelani, M., Scarano, V.L., Bertocci, F., Implementation and Characterization of a Medical Ultrasound Phased Array Probe with New Pb-free Soldering Materials, IEEE Trans. Instrum. Meas. 59, 2522–2529 (2010) CrossRefGoogle Scholar
Catelani, M., Scarano, V.L., Bertocci, F., Experimental Stress Characterization of a Biomedical Ultrasound Probe Soldered With Innovative Silver Isotropically Conductive Adhesive, IEEE Trans. Instrum. Meas. 61, 719–728 (2012) CrossRefGoogle Scholar
Tao, Y., Xia, Y., Wang, H., Gong, F., Wu, H., Tao, G., Novel isotropical conductive adhesives for electronic packaging application, IEEE Trans. Adv. Pack. 32, 589–592 (2009) CrossRefGoogle Scholar
D. Shangguan, Lead-Free Solder Interconnect Reliability (ASM international, Materials Park, Ohio, 2005)
Mir, I., Kumar, D., Recent advances in isotropic conductive adhesives for electronics packaging applications, Int. J. Adhes. Adhes. 28, 362–371 (2008) CrossRefGoogle Scholar
Klosterman, D., Li, L., Morris, J.E., Materials Characterization, Conduction Development, and Curing Effects on Reliability of Isotropically Conductive Adhesives, IEEE Trans. Comp. Pack. Manufact. Technol., Part A 21, 23–31 (1998) Google Scholar
Chang, D.D., Crawford, P.A., Fulton, J.A., McBride, R., Schmidt, M.B., Sinitski, R.E., Wong, C.P., An Overview and Evaluation of Anisotropically Conductive Adhesive Films for Fine Pitch Electronic Assembly, IEEE Trans. Comp. Hybr. Manuf. Technol. 16, 828–835 (1993) CrossRefGoogle Scholar
Catelani, M., Scarano, V.L., Bertocci, F., Berni, R., Optimization of the soldering process with ECAs in electronic equipment: characterization measurement and experimental design, IEEE Trans. Comp. Pack. Manuf. Technol. 1, 1616–1626 (2011) CrossRefGoogle Scholar
L. Li, J.E. Morris, J. Liu, Z. Lai, L. Ljungkrona, C. Li, Reliability and failure mechanism of isotropically conductive adhesives joints, Electronic Comp. Technol. Conf. (1995), pp. 114–120
Q.K. Tong, D.L. Markley, G. Frederickson, R. Kuder, D. Lu, Conductive Adhesives with Stable Contact Resistance and Superior Impact Performance, Electronic Comp. Technol. Conf. (1999), pp. 347–352
W.G. Cochran, G.M. Cox, Experimental Designs, 2nd edn. (John Wiley, New York, 1957)
Myers, R.H., Khuri, A.I., Vining, G.G., Response Surface alternatives to the Taguchi robust parameter design approach, Am. Stat. 46, 131–139 (1992) Google Scholar
Vining, G.G., Myers, R.H., Combining Taguchi and response surface philosophies: a dual response approach, J. Qual. Technol. 22, 38–45 (1990) Google Scholar
Nelder, J.A., Lee, Y., Generalized Linear Models for the analysis of Taguchi-type experiments, Appl. Stoch. Model D. A. 7, 107–120 (1991) CrossRefGoogle Scholar
Lee, Y., Nelder, J.A., Robust design via Generalized Linear Models, J. Qual. Technol. 35, 2–12 (2003) Google Scholar
Dror, A.H., Steinberg, D.M., Robust design for Generalized Linear Models, Technometrics 48, 520–529 (2006) CrossRefGoogle Scholar
L.W. Condra, Reliability Improvement With Design of Experiments, Quality and Reliability, 2nd edn. (Marcel Dekker, Inc., New York, 2001)
Sharma, P., Dasgupta, A., Micro-mechanics of creep-fatigue damage in PB-SN solder due to thermal cycling – Part II: mechanistic insights and cyclic durability predictions from monotonic data, ASME Trans. J. Electron. 124, 298–304 (2002) CrossRefGoogle Scholar
J.F. Lawless, Statistical Models and Methods for Lifetime Data (John Wiley & Sons, Hoboken, NJ, 2003)