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The Thickness Measurements of Thin Bulk Film by X-ray Method

Published online by Cambridge University Press:  06 March 2019

Y. Hirose
Affiliation:
Department of Civil Engineering and Material Research Center Northwestern University Evanston, Illinois, U.S.A.
N. Takano
Affiliation:
Department of Civil Engineering and Material Research Center Northwestern University Evanston, Illinois, U.S.A.
Y. Nanayama
Affiliation:
Department of Civil Engineering and Material Research Center Northwestern University Evanston, Illinois, U.S.A.
T. Mura
Affiliation:
Department of Civil Engineering and Material Research Center Northwestern University Evanston, Illinois, U.S.A.
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Extract

There are many investigations about thin film. However, these are limited to the surface layer thin film on substrates. It Is very important to know the characteristics of the extremely thin film itself such as surface layer thin film.

In the present paper, the first part deals with the thickness measurements of the surface layer film and substrate by means of x-ray method, and then the measurement method of their stress - strain curves and the procedure of the measurement are described. The results obtained are discussed on the basis of their stress — strain curves.

Type
XI. Thin Film and Semiconductor Characterization by X-Ray Diffraction
Copyright
Copyright © International Centre for Diffraction Data 1990

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References

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