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Stress Determination in an Adhesive Bonded Joint by X-Ray Diffraction*

Published online by Cambridge University Press:  06 March 2019

Paul Predecki  and
Charles S. Barrett
Paul Predecki
Affiliation:
University of Denver Research Institute, Denver, Colorado 80208
Charles S. Barrett
Affiliation:
University of Denver Research Institute, Denver, Colorado 80208
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Extract

At the present time there is considerable interest in the use of adhesive bonded joints for structural applications. The design of such joints is based mostly on finite element calculations and failure tests rather than on strain or stress measurements. To our knowledge no measurements have been made of stresses at or near the adhesive/adherend interface (where many bond failures occur) because of difficulties with accessibility. The purpose of this work was therefore to try to make such measurements using X-ray diffraction.

The approach taken was to gain access to the bond by making one of the adherends in a single lap joint to be relatively transparent to X-rays and the cither relatively opaque. Incident X-rays then penetrated the first adherend and the adhesive and were diffracted from gains in the second adherend adjacent to the adhesive/adherend interface. Stresses resulting from curing of the adhesive were determined first, after which a load was applied and the stresses redetermined.

Type
II. X-Ray Strain and Stress Determination
Information
Advances in X-Ray Analysis , Volume 27: Thirty-Second Annual Conference on Applications of X-ray Analysis, August 1-5, 1983 , 1983 , pp. 251 - 260
Copyright
Copyright © International Centre for Diffraction Data 1983

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Footnotes

*

Work supported by ARO on Grant No. DAAG29-81-0150.

References

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