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Proposed Methods for Depth Profiling of Residual Stresses using Beam-Limiting Masks

Published online by Cambridge University Press:  06 March 2019

Paul Predecki
Affiliation:
Engineering Dept. University of Denver Denver, CO USA
B. Ballard
Affiliation:
Engineering Dept. University of Denver Denver, CO USA
X. Zhu
Affiliation:
Engineering Dept. University of Denver Denver, CO USA
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Abstract

Methods are described which make use of x-ray absorbing masks to either limit beam penetration in the sample (Type I), or confine the diffracting volume within definite limits (Type II). The masks consist of a metal film of Au or U, containing many long, parallel apertures of effective width w and spacing c. The mask is either applied directly to the sample surface (Type I), or to a weakly absorbing film (Be or Kapton) on the sample surface (Type II). With the Type I mask, the diffracting volume can be limited to a surface layer whose maximum depth zm at ψ=0 varies linearly with w, irrespective of sample or wavelength. The masks can be used with ψ-tilts in an Ω-type goniometer, and strains and stresses can be determined by the Sin2ψ method. Depth profiles as a function of depth z (z-profiles) can be obtained with layer removal if gradients over the depth Zm can be neglected. With the Type n mask, the diffracting volume can be limited to a discrete subsurface layer whose average depth depends on (c+w) and the Bragg angle 2θ, and whose thickness depends on w and 2θ. z-Profiles can be obtained by varying the wavelength for a given reflection using a synchrotron source, without the need for layer removal. The methods have not yet been tested experimentally.

Type
V. X-Ray Characterization of Thin Films
Copyright
Copyright © International Centre for Diffraction Data 1992

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References

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