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Problems Associated with Kα Doublet in Residual Stress Measurements

Published online by Cambridge University Press:  06 March 2019

S. K. Gupta  and
B. D. Cullity
S. K. Gupta
Affiliation:
Department of Metallurgical Engineering and Materials, Science, University of Notre Dame, Notre Dame, Indiana 46556
B. D. Cullity
Affiliation:
Department of Metallurgical Engineering and Materials, Science, University of Notre Dame, Notre Dame, Indiana 46556
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Extract

Since the measurement of residual stress by X-ray diffraction techniques is dependent on the difference in angle of a diffraction peak maximum when the sample is examined consecutively with its surface at two different angles to the diffracting planes, it is important that these diffraction angles be obtained precisely, preferably with an accuracy of ± 0.01 deg. 2θ. Similar accuracy is desired in precise lattice parameter determination. In such measurements, it is imperative that the diffractometer be well-aligned. It is in the context of diffractometer alignment with the aid of a silicon powder standard free of residual stress that the diffraction peak analysis techniques described here have been developed, preparatory to residual stress determinations.

Type
X-Ray Diffraction Stress (Strain) Determination
Information
Advances in X-Ray Analysis , Volume 23: Twenty-Eighth Annual Conference on Applications of X-ray Analysis, July 30 - August 3, 1979 , 1979 , pp. 333 - 339
Copyright
Copyright © International Centre for Diffraction Data 1979

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References

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