Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-23T15:33:31.416Z Has data issue: false hasContentIssue false

Proposed Methods for Depth Profiling of Residual Stresses using Grazing Incidence X-Ray Diffraction (GIXD)

Published online by Cambridge University Press:  06 March 2019

Paul Predecki
Affiliation:
University of Denver, Denver CO USA
X. Zhu
Affiliation:
University of Denver, Denver CO USA
B. Ballard
Affiliation:
University of Denver, Denver CO USA
Get access

Abstract

Two proposed methods are described for obtaining the depth profiles (τ-profiles) of strains and stresses as a function of the 1/e penetration depth τ, using GIXD in the asymmetric geometry, without the need for layer removal. In the first, the ψ-method: ψ is varied, for a given reflection, while holding τ constant, by varying the wavelength λ and adjusting the incident angle α so as to maintain τ constant. This allows dϕ,ψ vs Sin2ψ plots to be obtained at constant τ. In the second, the ϕ-integral method: interplanar spacings dϕ,ψ are measured for ϕ values from 0 to 2π, at constant ψ and τ by holding α fixed. Two ψ values, i.e. two wavelengths, are needed to obtain the whole strain tensor, but if the sample is quasi-isotropic and the stress state is biaxial, only one wavelength is needed. A direct method is also described for obtaining the profiles as a function of depth z (z-profiles) from the corresponding τ-profiles using inverse Laplace transforms. Application of the method to the residual strain vs τ data of Doerner and Brennan for an Al film on Si is presented.

Type
V. X-Ray Characterization of Thin Films
Copyright
Copyright © International Centre for Diffraction Data 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Althaus, P.G., Industrial Diamond Review, 45, 124-127(1985)Google Scholar
Cohen, J. B., Dolle, H. and James, M. R., in “Accuracy in Powder Diffraction” NBS Special Publication No.567. U.S. Govt Printing Office, Wash D.C. 1980, pp. 453-77Google Scholar
Doerner, M.F. and Brennan, S., J. Appl. Phys., 63[1], 126131(1988).Google Scholar
Dolle, H., J. Appl. Cryst. 12, 489-501(1979).Google Scholar
Eigenmann, B., Scholtes, B. and Macherauch, E., Mater. Sci. and Eng. A118, 117(1989).Google Scholar
Fillit, R.Y., and Perry, A.J., Surface and Coatings Technology 36, 647-659(1988).Google Scholar
Green, D.J., Lange, F.F. and James, M.R., J. Am. Ceram. Soc., 66[9], 623–29(1983).Google Scholar
Hart, M., Parrish, W., Bellotto, M. and Lim, G.S., Acta Cryst., A44, 193-197(1988)Google Scholar
Hauk, V. M., Advances in X-ray Analysis, 27, 101-120(1984).Google Scholar
Hauk, V., Oudelhoven, R.M.W. and Vaessen, G.H.J., Met Trans A, 13A, 1239(1982).Google Scholar
Houska, C. R. in Experimental Methods, Part A, Treatise on Materials Science and Technology (H. Herman, Ed.) Vol 19A, pp 63105, Academic Press, 1980.Google Scholar
Hwang, Bing and Houska, C.R., J. Appl. Phys., 63[11], 53515356(1988).Google Scholar
Johnson-Walls, D., Evans, A.G., Marshall, D.B. and James, M.R., J. Am. Ceram. Soc. 69[1], 4447(1986).Google Scholar
Lode, W. and Peiter, A., Metall 35, 758 (1981).Google Scholar
Loxley, N., Monteiro, A., Cooke, M.L., Bowen, D.K., and Tanner, B.K., Mater. Res. Soc. Symp. Proc. (1992)Google Scholar
Noyan, I. C. Metall Trans. A14 A, 249–58(1984).Google Scholar
Noyan, I. C. and Cohen, J. B., Advances in X-ray Analysis 27, 129-148(1984).Google Scholar
Noyan, I. C. and Cohen, J. B., “Residual Stress, Measurement by Diffraction and Interpretation”, Springer Verlag p 144(1987).Google Scholar
Parratt, L. G., Phys Rev., 95, 359-369(1954).Google Scholar
Predecki, P. K., submitted to Powder Diffraction, 1992.Google Scholar
Sasaki, T., Kuramoto, M. and Yoshioka, Y., Advances in X-ray Analysis, 27, 121128(1984)Google Scholar
Segmuller, A. and Murakami, M., in “Treatise on Materials Science and Technology”, Vol 27, Academic Press Inc 1988, pp 143200.Google Scholar
Shiraiwa, T. and Sakamoto, Y., Sumitomo Search, 7, 109-135(1972).Google Scholar
Shute, C.J. and Cohen, J.B., J. Appl. Phys. 70[4], 21042110(1991)Google Scholar
Somers, M. A. J. and Mittemeijer, E.J., Metal. Trans. 21A, 189204(1990).Google Scholar
Toney, M.F. and Brennan, S., Phys. Rev. B 39, 7963 (1989).Google Scholar
Wagner, C.N.J., Boldrick, M.S. and Perez-Mendez, V., Advances in X-ray Analysis, 26, 275 (1983).Google Scholar
Wagner, C.N.J., Eigenmann, B. and Boldrick, M.S., Advances in X-ray Analysis 31, 181-188(1988).Google Scholar
Winholtz, R.A. and Cohen, J.B., Aust. J. Phys., 41, 189-99(1988).Google Scholar
Wolfstieg, U. Haerterei-Techn. Mitt. 31, 19-22(1976).Google Scholar