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EDXRF Analysis of Thin Films and Coatings Using a Hybrid Alphas Approach

Published online by Cambridge University Press:  06 March 2019

Dennis J. Kalnicky
Dennis J. Kalnicky*
Affiliation:
Princeton Gamma - Tech 1200 State Road Princeton, NJ 08540
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In the semiconductor and electronics industries the processes Involved in producing integrated circuit soften require thin films such as P205/SiO2, Si/Al, Ni/Cr, Fe/Ni, or others to be deposited on a substrate wafer. It is critical to the performance and life time of the device that the composition and thickness of these films be precisely controlled. The ability to quickly analyze wafers provides data which can be used to adjust fabrication parameters before large quantities of devices are lost.

Type
Research Article
Information
Advances in X-Ray Analysis , Volume 29: Thirty-Fourth Annual Conference on Applications of X-ray Analysis, August 5-9, 1985 , 1985 , pp. 403 - 411
Copyright
Copyright © International Centre for Diffraction Data 1985

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