Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-25T03:00:53.212Z Has data issue: false hasContentIssue false
  • English
  • Français

Comparison of Residual Stress Measurement and Breaking Strength on Alumina Rods

Published online by Cambridge University Press:  06 March 2019

D. J. Snoha ,
C. O. Ruud  and
H. D. Cassel
D. J. Snoha
Affiliation:
Materials Research Laboratory The Pennsylvania State University University Park, PA 16802
C. O. Ruud
Affiliation:
Materials Research Laboratory The Pennsylvania State University University Park, PA 16802
H. D. Cassel
Affiliation:
Materials Research Laboratory The Pennsylvania State University University Park, PA 16802
Get access

Abstract

X-ray diffraction (XRD) utilizing copper K-alpha radiation and the single exposure technique (SET) was used for residual stress measurement on two different thermal treatments of Al-300 alumina rods. The measurements were performed in the axial and tangential directions on forty halves of twenty broken rods. The twenty rods were intially annealed for 8 hours at 1000°C; then ten were slow cooled and ten were equilibrated at 1450°C then force-air quenched. A fine mesh sapphire (alumina) powder was used as a zero stress standard for the determination of calibration validity of the position sensitive scintillation detector based (PSSD) stress measuring instrument used for this study. This instrument was developed at the Materials Research Laboratory of The Pennsylvania State University.

Type
Research Article
Information
Advances in X-Ray Analysis , Volume 29: Thirty-Fourth Annual Conference on Applications of X-ray Analysis, August 5-9, 1985 , 1985 , pp. 43 - 48
Copyright
Copyright © International Centre for Diffraction Data 1985

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ruud, C.O., “Position Sensitive Detector Improves X-Ray Powder Diffraction”, Ind. Res, and Dev., pp. 84-87, Jan. (1983).Google Scholar
2. Tree, Y., Venkateswaran, A., and Hasselman, D.F.H., “Observations on the Fracture and Deformation Behavior During Annealing of Residually Stressed Polycrystalline Aluminum Oxides”, J. Mat. Sci., 18:2135- 2148 (1983).Google Scholar
3. Ruud, C.O. and Snoha, D.J., “Displacement Errors in the Application of Portable X-Ray Diffraction Stress Measurement Instrumentation”, J. of Met., 36(2):32–38 (1984).Google Scholar
4. Cockbain, A.G., “Strain in Hot Pressed Dense Silicon Nitride”, Proc. Brit. Cer. Soc. 25, 253–259 (1975).Google Scholar
5. Smith, D.K. and Weissmann, S., “Residual Stress and Grain Deformation in Extruded Polycrystalline BeO Ceramics”, J. Am. Cer. Soc. 51(6), 330-336 (1968).Google Scholar
6. James, M.R., Green, D.J., and Lange, F.T., “Determination, of Residual Stresses in Transformation-Toughened Ceramics”, Adv. in X-Ray Anal. 27, 221–228 (1984).Google Scholar
7. Semple, C.W., “Residual Stress Determination in Alumina Bodies”, AMMRC. R. 0-74, D/A. roj. IT062105A330, AMCMS. ode 502E.11.296, AMMRC. June 1970.Google Scholar