Element contents
Hybrid Systems-in-Foil
Published online by Cambridge University Press: 14 September 2021
Summary
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
- Type
- Element
- Information
- Online ISBN: 9781108985116Publisher: Cambridge University PressPrint publication: 14 October 2021
References
Moore, G. E., “Cramming more components onto integrated circuits,” Electronics, vol. 38, no. 8, pp. 114 ff., April 1965.Google Scholar
Wong, P., keynote speech at the Hot Chips conference, Stanford University, August 18–20, 2019.Google Scholar
Moore, S. K., “Another step toward the end of Moore’s law: Samsung and TSMC move to 5-nanometer manufacturing,” IEEE Spectrum, vol. 56, no. 6, pp. 9–10, May 2019.Google Scholar
Ye, P., Ernst, T., and Khare, M. V., “The last silicon transistor: Nanosheet devices could be the final evolutionary step for Moore’s Law,” IEEE Spectrum, vol. 56, no. 8, pp. 30–35, August 2019.CrossRefGoogle Scholar
Arden, W. et al., “More-than-Moore White Paper,” White Paper in International Technology Roadmap for Semiconductors (ITRS), 2010. www.yumpu.com/s/X5NAyREt1px0eEfNGoogle Scholar
Afsar, Y. et al., “15.1 Large-scale acquisition of large-area sensors using an array of frequency-hopping ZnO thin-film-transistor oscillators,” Proceedings of the IEEE International Solid-State Circuits Conference (ISSCC), pp. 256–257, February 2017.Google Scholar
Moy, T. et al., “An EEG acquisition and biomarker-extraction system using low-noise-amplifier and compressive-sensing circuits based on flexible, thin-film electronics,” IEEE Journal of Solid-State Circuits, vol. 52, no. 1, pp. 309–321, January 2017.CrossRefGoogle Scholar
Quintero, A. V. et al., “Smart RFID label with a printed multisensor platform for environmental monitoring,” Flexible Printed Electronics, vol. 1, no. 2, pp. 1–13, January 6, 2016.CrossRefGoogle Scholar
Papadopoulos, N. P. et al., “Toward temperature tracking with unipolar metal-oxide thin-film SAR C-2 C ADC on plastic,” IEEE Journal of Solid-State Circuits, vol. 53, no. 8, pp. 2263–2272, August 2018.CrossRefGoogle Scholar
Ma, Z. et al., “Materials and design considerations for fast flexible and stretchable electronics,” Proceedings of the IEEE International Electron Devices Meeting (IEDM), Washington, DC, February 16, 2015, pp. 19.2.1–19.2.4.Google Scholar
Jung, Y. H., Zhang, H., Cho, S. J., and Ma, Z., “Flexible and stretchable microwave microelectronic devices and circuits,” IEEE Transactions on Electron Devices, vol. 64, no. 5, pp. 1881–1893, May 2017.CrossRefGoogle Scholar
Harendt, C. et al., “Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips,” 44th European Solid State Device Research Conference (ESSDERC), Venice, 2014, pp. 210–213.CrossRefGoogle Scholar
Burghartz, J. N. et al., “Hybrid Systems-in-Foil – combining the merits of thin chips and of large-area electronics,” IEEE Journal of the Electron Devices Society, vol. 7, pp. 776–783, 2019.CrossRefGoogle Scholar
Burghartz, J. N. et al., “Hybrid Systems-in-Foil – combining the merits of thin chips and of large-area electronics,” IEEE Journal of the Electron Devices Society, vol. 7, pp. 776–783, 2019.CrossRefGoogle Scholar
Jung, M. et al., “Amorphous FeZr metal for multi-functional sensor in electronic skin,” npj Flexible Electronics, vol. 3, April 2019, 8.Google Scholar
Sun, D. et al., “Flexible high-performance carbon nanotube integrated circuits,” Nature Nanotechnology, vol. 6, pp. 156–161, February 2011.CrossRefGoogle ScholarPubMed
Sun, Y., M. et al., “Flexible organic photovoltaics based on water-processed silver nanowire electrodes,” Nature Electronics, 2, pp. 513–520, November 2019.CrossRefGoogle Scholar
Li, W., Yang, S., and Shamim, A., “Screen printing of silver nanowires: Balancing conductivity with transparency while maintaining flexibility and stretchability,” npj Flexible Electronics, vol. 3, no. 13, December 2019. DOI: https://doi.org/10.1038/s41528-019-0057-1Google Scholar
Burghartz, J. N. et al., “Hybrid Systems-in-Foil – combining the merits of thin chips and of large-area electronics,” IEEE Journal of the Electron Devices Society, vol. 7, pp. 776–783, 2019.CrossRefGoogle Scholar
Myny, K. et al., “An 8b organic microprocessor on plastic foil,” IEEE International Solid-State Circuits Conference, San Francisco, 2011, pp. 322–324.Google Scholar
Myny, K. et al., ”15.2 A flexible ISO14443-A compliant 7.5 mW 128b metal-oxide NFC barcode tag with direct clock division circuit from 13.56 MHz carrier,” Proceedings of the IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, 2017, pp. 258–259.Google Scholar
Elsobky, M. et al., “Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies,” Electronics Letters, vol. 54, no. 6, pp. 338–340, March 22, 2018.Google Scholar
Elsobky, M. et al., “Characterization of thin-film temperature sensors and ultra-thin chips for HySiF integration,” 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). DOI: https://doi.org/10.1109/FLEPS.2019.8792313.Google Scholar
Mahsereci, Y., Sailer, S., Richter, H., and Burghartz, J., “16.1 An ultra-thin flexible CMOS stress sensor demonstrated on an adaptive robotic gripper,” Proceedings of the IEEE International Solid-State Circuits Conference – (ISSCC) Digest of Technical Papers, San Francisco, February 22–26, 2015, pp. 1–3.Google Scholar
Elsobky, M. et al., “Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies,” Electronics Letters, vol. 54, no. 6, pp. 338–340, March 22, 2018.Google Scholar
Elsobky, M. et al., “Ultra-thin sensor systems integrating silicon chips with on-foil passive and active components,” Proceedings, vol. 2, p. 748, December 2018.Google Scholar
Cook, B. S., Cooper, J. R., and Tentzeris, M. M., “Multi-Layer RF capacitors on flexible substrates utilizing inkjet printed dielectric polymers,” IEEE Microwave and Wireless Components Letters, vol. 23, no. 7, pp. 353–355, July 2013.Google Scholar
Widlund, T., Yang, S., Hsu, Y.-Y., and Lu, N., “Stretchability and compliance of freestanding serpentine-shaped ribbons,” International Journal of Solids and Structures, vol. 51, August 2014.Google Scholar
Hocheng, H. and Chen, C.-M., “Design, fabrication and failure analysis of stretchable electrical routings,” Sensors, vol. 14, pp. 11855–11877, July 2014.Google Scholar
Nguyen, T. T. et al., “A flexible bimodal sensor arrays for simultaneous sensing of pressure and temperature,” Advanced Materials, vol. 26, no. 5, pp. 796–804, February 2014.Google Scholar
Hua, Q. et al., “Skin-inspired highly stretchable and conformable matrix networks for multifunctional sensing,” Nature Communications, vol. 9, December 2018.CrossRefGoogle ScholarPubMed
Kim, K. et al., “Low-voltage, high-sensitivity and high-reliability bimodal sensor array with fully inkjet-printed flexible conducting electrode for low power consumption electronic skin,” Nano Energy, vol. 41, pp. 301–307, November 2017.CrossRefGoogle Scholar
Escobedo, P., Bhattacharjee, M., Nikbakhtnasrabadi, F., and Dahiya, R., “Smart bandage with wireless strain and temperature sensors and batteryless NFC tag,” IEEE Internet of Things Journal, vol. 8, no.6, pp. 5093–5100, March 15, 2021.Google Scholar
Yang, H. et al., “Wireless Ti3C2Tx MXene strain sensor with ultrahigh sensitivity and designated working windows for soft exoskeletons,” ACS Nano, vol. 14, no. 9, pp. 11860–11875, August 11, 2020.Google Scholar
Tian, B. et al., “Three-dimensional flexible nanoscale field-effect transistors as localized bioprobes,” Science, vol. 329, pp. 830–834, August 2010.Google Scholar
Khodagholy, D. et al., “In vivo recordings of brain activity using organic transistors,” Nature Communications, vol. 4, no. 1575, March 12, 2013. DOI: https://doi.org/10.1038/ncomms2573CrossRefGoogle ScholarPubMed
Robinson, J. T. et al., “Developing next-generation brain sensing technologies – a review,” IEEE Sensors Journal, vol. 19, no. 22, 2019. DOI: https://doi.org/10.1109/jsen.2019.2931159.CrossRefGoogle ScholarPubMed
Yu, L. et al., “High-yield large area MoS2 technology: Material, device and circuits co-optimization,” 2016 IEEE International Electron Devices Meeting (IEDM), San Francisco, 2016, pp. 5.7.1–5.7.4.CrossRefGoogle Scholar
Ahmed, S., Tahir, F. A., Shamim, A., and Cheema, H. M., “A compact Kapton-based inkjet-printed multiband antenna for flexible wireless devices,” IEEE Antennas and Wireless Propagation Letters, vol. 14, pp. 1802–1805, 2015.Google Scholar
Tang, M., Shi, T., and Ziolkowski, R. W., “Flexible efficient quasi-yagi printed uniplanar antenna,” IEEE Transactions on Antennas and Propagation, vol. 63, no. 12, pp. 5343–5350, December 2015.Google Scholar
Yi-Bing, C., Alex, P., Fuzhi, H., and Yong, P., “Print flexible solar cells,” Springer Nature, vol. 539, no. 7630, pp. 488–489, November 2016.Google Scholar
Ntagios, M., Escobedo, P., and Dahiya, R., ”3D printed packaging of photovoltaic cells for energy autonomous embedded sensors,” 2020 IEEE SENSORS, Rotterdam, Netherlands, 2020, pp. 1–4.Google Scholar
Garcia Nunez, C., Manjakkal, L., and Dahiya, R., “Energy autonomous electronic skin,” npj Flexible Electronics, vol. 3, December 2019. DOI: https://doi.org/10.1038/s41528-018-0045-xGoogle Scholar
Hu, Y. and Sun, X., “Flexible rechargeable lithium ion batteries: Advances and challenges in materials and process technologies,” J. Mater. Chem. A, vol. 2, pp. 10712–10738, July 28, 2014.Google Scholar
Cha, H., Kim, J., Lee, Y., Cho, J., and Park, M., “Issues and challenges facing flexible lithium-ion batteries for practical application,” Small, vol. 14, December 2017, e170 2989. DOI: https://doi.org/10.1002/smll.201702989Google Scholar
Manjakkal, L., Pullanchiyodan, A., Yogeswaran, N., Hosseini, E. S., and Dahiya, R., “A wearable supercapacitor based on conductive PEDOT:PSS‐coated cloth and a sweat electrolyte,,” Adv. Mater. 2020, vol. 32, no. 24, 1907254. DOI: https://doi.org/10.1002/adma.201907254Google Scholar
Ozer, E. et al., “Bespoke machine learning processor development framework on flexible substrates,” 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, July 8–10, 2019, pp. 1–3.Google Scholar
Gupta, S., Navaraj, W. T., Lorenzelli, L., and Dahiya, R., “Ultra-thin chips for high-performance flexible electronics,” npj Flexible Electronics, vol. 2, no. 8, March 14, 2018. DOI: https://doi.org/10.1038/s41528-018-0021-5.CrossRefGoogle Scholar
Ruther, P., Herwik, S., Kisban, S., Seidl, K., and Paul, O., “Recent progress in neural probes using silicon MEMS technology,” IEEJ Transactions on Electrical and Electronic Engineering, vol. 5, no. 5, pp. 505–515, 2010.CrossRefGoogle Scholar
Sevilla, G. A. T., Inayat, S. B., Rojas, J. P., Hussain, A. M., and Hussain, M. M., ”Flexible and semi-transparent thermoelectric energy harvesters from low cost bulk silicon (100)},” Small, vol. 9, no. 23, pp. 3916–3921, 2013.Google Scholar
Schander, A. et al., “Design and fabrication of novel multi-channel floating neural probes for intracortical chronic recording,” Sensors and Actuators A: Physical, vol. 247, pp. 125–135, August 15, 2016.Google Scholar
NXP Semiconductors, “ePassports – secure chip based travel documents,” www.nxp.com/applications/solutions.Google Scholar
Takyu, S., Kurosawa, T., Shimizu, N., and Harada, S., “Novel wafer dicing and chip thinning technologies realizing high chip strength,” Proceedings of the 56th Electronic Components and Technology Conference 2006, San Diego, 2006. DOI: https://doi.org/10.1109/ECTC.2006.1645874.Google Scholar
Hassan, M., Angelopoulos, E. A., Rempp, H., Endler, S., and Burghartz, J. N., “Packaging challenges associated with warpage of ultra-thin chips,” Proceedings of the 3rd Electronics System Integration Technology Conference ESTC, Berlin, pp. 505–515, 2010. DOI: https://doi.org/10.1109/ESTC.2010.5642819CrossRefGoogle Scholar
Morcom, W. R. et al. Self-supported ultra thin silicon wafer process. US patent 6162702 A (2000).Google Scholar
Weldon, M. K. et al., “Mechanism of silicon exfoliation by hydrogen implantation and He, Li and Si co-implantation [SOI technology],” 1997 IEEE International SOI Conference Proceedings, Fish Camp, CA, 1997, pp. 124–125.Google Scholar
Braley, C., “Si exfoliation by MeV proton implantation,” Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, vol. 277, pp. 93–97, April 2012.CrossRefGoogle Scholar
Shahrjerdi, D. and Bedell, S. W., ”Extremely flexible nanoscale ultrathin body silicon integrated circuits on plastic,” Nano Letters, vol. 13, no. 1, pp. 315–320, January 2013.Google Scholar
Burghartz, J. N., “You can’t be too thin or too flexible,” IEEE Spectrum, vol. 50, no. 3, pp. 38–61, March 2013.Google Scholar
Kato, Y. et al., “A large-area, flexible, ultrasonic imaging system with a printed organic transistor active matrix,” Proceedings of the IEEE International Electron Devices Meeting, San Francisco. DOI: https://doi.org/10.1109/TED.2010.2044278.Google Scholar
Ahmed, M., Butler, D. P., and Celik-Butler, Z., “MEMS absolute pressure sensor on a flexible substrate,” Proceedings of the IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS), Paris, 2012, pp. 575–578.Google Scholar
Gao, B., Yuen, M. M. F., and Ye, T. T., “Flexible frequency selective metamaterials for microwave applications,” Scientific Reports, vol. 7, March 2017. DOI: https://doi.org/10.1038/srep45108Google ScholarPubMed
Augustine, R. et al., “SAR reduction of wearable antennas using polymeric ferrite sheets,” Proceedings of the Fourth European Conference on Antennas and Propagation, Barcelona, April 12–16, 2010, pp. 1–3.Google Scholar
Ahmed, S., Tahir, F. A., Shamim, A., and Cheema, H. M., “A compact Kapton-based inkjet-printed multiband antenna for flexible wireless devices,” IEEE Antennas and Wireless Propagation Letters, vol. 14, pp. 1802–1805, 2015.Google Scholar
Tang, M., Shi, T., and Ziolkowski, R. W., “Flexible efficient quasi-yagi printed uniplanar antenna,” IEEE Transactions on Antennas and Propagation, vol. 63, no. 12, pp. 5343–5350, December 2015.Google Scholar
Kiourti, A. and Volakis, J. L., “Stretchable and flexible e-fiber wire antennas embedded in polymer,” IEEE Antennas and Wireless Propagation Letters, vol. 13, pp. 1381–1384, 2014.CrossRefGoogle Scholar
Simorangkir, R. B. V. B., Yang, Y., Esselle, K. P., and Zeb, B. A., “A method to realize robust flexible electronically tunable antennas using polymer-embedded conductive fabric,” IEEE Transactions on Antennas and Propagation, vol. 66, no. 1, pp. 50–58, January 2018.Google Scholar
Su-Tsai, Lu and Chen, Wen-Hwa, “Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints,” Proceedings of the 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, 2008, pp. 1287–1293.Google Scholar
Banda, C., Johnson, R. W., Zhang, T., Hou, Z., and Charles, H. K., “Flip chip assembly of thinned silicon die on flex substrates,” IEEE Transactions on Electronics Packaging Manufacturing, vol. 31, no. 1, pp. 1–8, January 2008.CrossRefGoogle Scholar
Marinov, V. et al., “Laser-enabled advanced packaging of ultrathin bare dice in flexible substrates,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 4, pp. 569–577, April 2012.Google Scholar
Wolf, J. et al., “Ultra-thin silicon chips in flexible microsystems,” Proceedings of the 13th Electronic Circuits World Convention ECWC, Nuremberg, Germany, May 2014.Google Scholar
Sridhar, A., Cauwe, M., Fledderus, H., Kusters, R. H. L., and van den Brand, J., “Novel interconnect methodologies for ultra-thin chips on foils,” 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, 2012, pp. 238–244.Google Scholar
van den Brand, J., de Baets, J., van Mol, T., and Dietzel, A., “Systems-in-Foil – Devices, fabrication processes and reliability issues,” Journal of Microelectronics Reliability, vol. 48, no. 8–9, pp. 1123–1128, 2008.Google Scholar
Govaerts, J., Christiaens, W., Bosman, E., and Vanfleteren, J., “Fabrication processes for embedding thin chips in flat flexible substrates,” IEEE Transactions on Advanced Packaging, vol. 32, no. 1, pp. 77–83, February 2009.Google Scholar
Kuo, Tzu-Ying et al., “Flexible and ultra-thin embedded chip package,” 2009 59th Electronic Components and Technology Conference, San Diego, 2009, pp. 1749–1753.Google Scholar
Christiaens, W., Bosman, E., and Vanfleteren, J., “UTCP: A novel polyimide-based ultra-thin chip packaging technology,” IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 4, pp. 754–760, December 2010.Google Scholar
Palavesam, N., Hell, W., Drost, A., Landesberger, C., Kutter, C., and Bock, K., “A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics,” 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), pp. 6–11, 2019. doi: https://doi.org/10.23919/NORDPAC.2019.8760350.Google Scholar
Boettcher, L., Manessis, D., Ostmann, A., Karaszkiewicz, S., and Reichl, H., “Embedding of chips for System in Package realization – technology and applications,” 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, Taipei, Taiwan, pp. 383–386, October 22–24, 2008.Google Scholar
Manessis, D., Boettcher, L., Karaszkiewicz, S., Ostmann, A., Aschenbrenner, R., and Lang, K., “Chip embedding technology developments leading to the emergence of miniaturized system-in-packages,” Proceedings of the 18th European Microelectronics & Packaging Conference, Brighton, UK, pp. 1–8, September 12–15, 2011.Google Scholar
Sterken, T. et al., “Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system,” 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2011, pp. 6886-6889, doi: https://doi.org/10.1109/IEMBS.2011.6091734.Google Scholar
Burghartz, J. N. and Harendt, C., “Method for producing an integrated circuit and resulting film chip,” US Patent 20120161293 A1, issue date: July 6, 2012.Google Scholar
Elsobky, M. et al., “Characterization of on-foil sensors and ultra-thin chips for HySiF integration,” in IEEE Sensors Journal, vol. 20, no. 14, pp. 7595–7604, July 15, 2020.Google Scholar
Elsobky, M. et al., “Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies,” Electronics Letters, vol. 54, no. 6, pp. 338–340, March 2018.Google Scholar
Hassan, M. et al., “Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications,” Proceedings of the 2015 European Microelectronics Packaging Conference (EMPC), Friedrichshafen, Germany, pp. 1–6, September 14–16, 2015.Google Scholar
Hassan, M., Schomburg, C., Harendt, C., Penteker, E., and Burghartz, J. N., “Assembly and embedding of ultra-thin chips in polymers,” Proceedings of the 2013 European Microelectronics Packaging Conference (EMPC), Grenoble, France. pp. 1–6, September 9–12, 2013.Google Scholar
Alavi, G., Sailer, H., Albrecht, B., Harendt, C., and Burghartz, J. N., “Adaptive layout technique for microhybrid integration of chip-film patch,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 5, pp. 802–810, May 2018.CrossRefGoogle Scholar
Papadopoulos, N. P. et al., “Toward temperature tracking with unipolar metal-oxide thin-film SAR C-2 C ADC on plastic,” IEEE Journal of Solid-State Circuits, vol. 53, no. 8, pp. 2263–2272, August 2018.CrossRefGoogle Scholar
Leng, X., Li, W., Luo, D. and Wang, F., “Differential structure with graphene oxide for both humidity and temperature sensing,” IEEE Sensors Journal, vol. 17, no. 14, pp. 4357–4364, 2017.Google Scholar
Webb, R. Chad et al., “Ultrathin conformal devices for precise and continuous thermal characterization of human skin,” Nature Materials, vol. 12, pp. 938–944, 2013.Google Scholar
Pan, S. and Makinwa, K. A. A., “A 0.25 mm2-resistor-based temperature sensor with an inaccuracy of 0.12 °C (3σ) from −55 °C to 125 °C,” IEEE Journal of Solid-State Circuits, vol. 53, no. 12, pp. 3347–3355, December 2018.Google Scholar
Soni, M., Bhattacharjee, M., Ntagios, M., and Dahiya, R., “Printed temperature sensor based on PEDOT: PSS-graphene oxide composite,” IEEE Sensors Journal, vol. 20, no. 14, pp. 7525–7531, July 15, 2020.Google Scholar
Elsobky, M. et al. , “Characterization of thin-film temperature sensors and ultra-thin chips for HySiF integration,” Proceedings of IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), pp. 1–3, 2019. doi: https://doi.org/10.1109/FLEPS.2019.8792313.Google Scholar
Modafe, A., Ghalichechian, N., Powers, M., Khbeis, M., and Ghodssi, R., “Embedded benzocyclobutene in silicon: An integrated fabrication process for electrical and thermal isolation in MEMS,” Microelectronic Engineering, vol. 82, pp. 157–167, 2005.Google Scholar
Malik, I. J. et al., “Surface roughness of silicon wafers on different lateral length scales,” Journal Electrochemical Society, vol. 140, no. 5, pp. 75–77, May 1993.Google Scholar
Szendrei, K. et al., “Touchless optical finger motion tracking based on 2D nanosheets with giant moisture responsiveness,” Advanced Materials, vol. 27, pp. 6341–6348, 2015.Google Scholar
Elsobky, M. et al., “Ultra-thin relative humidity sensors for hybrid system-in-foil applications,” Proceedings of IEEE SENSORS, Glasgow, 2017.Google Scholar
Elsobky, M. et al., “Relative humidity sensors for system-in-foil applications,” Proceedings of MikroSystemTechnik Congress, Munich, Germany, 2017.Google Scholar
Mahsereci, Y., Saller, S., Richter, H., and Burghartz, J. N., “An ultra-thin flexible CMOS stress sensor demonstrated on an adaptive robotic gripper,” IEEE Journal of Solid-State Circuits, vol. 51, no. 1, pp. 273–280, January 2016.Google Scholar
Kuhl, M. et al., “A wireless stress mapping system for orthodontic brackets using CMOS integrated sensors,” IEEE Journal of Solid-State Circuits, vol. 48, no. 9, pp. 2191–2202, September 2013.Google Scholar
Huber, S., Leten, W., Ackermann, M., Schott, C., and Paul, O., “A fully integrated analog compensation for the piezo-Hall effect in a CMOS single-chip Hall sensor microsystem,” IEEE Sensors Journal, vol. 15, no. 5, pp. 2924–2933, May 2015.Google Scholar
Pang, C. et al., “A flexible and highly sensitive strain-gauge sensor using reversible interlocking of nanofibers,” Nature Materials, vol. 11, pp. 795–801, September 2012.CrossRefGoogle Scholar
Yin, F. et. al., “Highly sensitive and transparent strain sensors with an ordered array structure of AgNWs for wearable motion and health monitoring,” Scientific Reports, vol. 9, February 2019.Google Scholar
Guo, H. et al., “Vectorial strain gauge method using single flexible orthogonal polydimethylsiloxane gratings,” Scientific Reports, vol. 6, March 2013.Google Scholar
Elsobky, M., Mahsereci, Y., Keck, J., Richter, H., and Burghartz, J. N., “Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges,” Advances in Radio Science, vol. 15, pp. 123–130, September 2017.Google Scholar
Wen, Y.-H. et al., “Mechanically robust micro-fabircated strain gauges for use on bones,” Proceedings of the Conference on Microtechnologies in Medicine and Biology, pp. 302–304, 2005.Google Scholar
Stephen, R. J., Rajanna, K., Dhar, V., Kumar, K. K., and Nagabushanam, S., “Thinfilm strain gauge sensors for ion thrust measurement,” IEEE Sensors Journal, vol. 4, pp. 373–377, 2004.Google Scholar
Paulsen, J. A. and Renn, M. J., Maskless Printing of Miniature Polymer Thick Film Resistors for Embedded Applications. Optomec, Inc., 2014.Google Scholar
Hedges, M., Renn, M., and Kardos, M., “Mesoscale deposition technology for electronics applications,” Proceedings of the 5th International Conference on Polymers and Adhesives, pp. 53–57, 2005. doi: https://doi.org/10.1109/POLYTR.2005.1596486.Google Scholar
Ando, B., Baglio, S., Malfa, S. L., and L’Episcopo, G., “All inkjet printed system for strain measurement,” IEEE Sensors Journal, vol. 13, pp. 4874–4879, 2013.Google Scholar
Kiourti, A. and Volakis, J. L., “Stretchable and flexible e-fiber wire antennas embedded in polymer,” IEEE Antennas and Wireless Propagation Letters, vol. 13, pp. 1381–1384, 2014.CrossRefGoogle Scholar
Meister, T. et al., “Program FFlexCom – High frequency flexible bendable electronics for wireless communication systems,” Proceedings of the IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS), pp. 1–6, 2017. doi: https://doi.org/10.1109/COMCAS.2017.8244733.Google Scholar
Elsobky, M. et al., “Ultra-thin sensor systems integrating silicon chips with on-foil passive and active component,” Proceedings, vol. 2, no. 748, December 2018.Google Scholar
Di Massa, G., Costanzo, S., Borgia, A., Venneri, F., and Venneri, I., “Innovative dielectric materials at millimeter-frequencies,” Proceedings of the 20th International Conference on Applied Electromagnetics and Communications (ICECom), Dubrovnik, 2010.Google Scholar
Alavi, G., “Hybrid system-in-foil integration and interconnection technology based on adaptive layout technique,” University of Stuttgart, Ph.D. dissertation, 2019.Google Scholar
Alavi, G. et al., “Embedding and interconnecting of ultra-thin rf chip in combination with flexible wireless hub in polymer foil,” Proceedings of the 7th Electronic System-Integration Technology Conference (ESTC), pp. 1–5, 2018, .CrossRefGoogle Scholar
Ha, S., Kim, C., Park, J., Joshi, S., and Cauwenberghs, G., “Energy recycling telemetry IC with simultaneous 11.5 mW power and 6.78 Mb/s backward data delivery over a single 13.56 MHz inductive link,” IEEE Journal of Solid-State Circuits, vol. 51, no. 11, pp. 2664–2678, November 2016. doi: https://doi.org/10.1109/JSSC.2016.2600864.Google Scholar
Produktfähige autarke und sichere Foliensysteme für Automatisierungslösungen in Industrie 4.0, Project Website [online], www.parsifal40.de, accessed March 5, 2021.Google Scholar
Qi, G., Mak, P., and Martins, R. P., “26.9 A 0.038 mm2 SAW-less multiband transceiver using an N-Path SC gain loop,” Proceedings of the IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, pp. 452–454, 2016.Google Scholar
Tseng, Y. and Ma, T., “On-chip GIPD bandpass filter using synthesized stepped impedance resonators,” IEEE Microwave and Wireless Components Letters, vol. 24, no. 3, pp. 140–142, March 2014.Google Scholar
Bandyopadhyay, S., Mercier, P. P., Lysaght, A. C., Stankovic, K. M., and Chandrakasan, A. P., “A 1.1 nW energy-harvesting system with 544 pW quiescent power for next-generation implants,” IEEE Journal of Solid-State Circuits, vol. 49, no. 12, pp. 2812–2824, December 2014.Google Scholar
Ha, S., Kim, C., Park, J., Joshi, S., and Cauwenberghs, G., “Energy recycling telemetry IC with simultaneous 11.5 mW power and 6.78 Mb/s backward data delivery over a single 13.56 MHz inductive link,” IEEE Journal of Solid-State Circuits, vol. 51, no. 11, pp. 2664–2678, November 2016. doi: https://doi.org/10.1109/JSSC.2016.2600864.Google Scholar
Won, S. M. et al., “Piezoresistive strain sensors and multiplexed arrays using assemblies of single-crystalline silicon nanoribbons on plastic substrates,” IEEE Transactions on Electron Devices, vol. 58, no. 11, pp. 4074–4078, November 2011.Google Scholar
Elsobky, M. et al., “A digital library for a flexible low-voltage organic thin-film transistor technology,” Organic Electronics, vol. 50, pp. 491–498, November 2017.Google Scholar
Ghani, T. et al., “A 90 nm high volume manufacturing logic technology featuring novel 45 nm gate length strained silicon CMOS transistors,” Proceedings of the IEEE International Electron Devices Meeting, Washington, DC, 2003.Google Scholar
Heidari, H., Wacker, N., and Dahiya, R., “Bending induced electrical response variations in ultra-thin flexible chips and device modeling,” Applied Physics Reviews, vol. 4, 2017.Google Scholar
Hassan, M. et al., “Anomalous stress effects in ultra-thin silicon chips on foil,” Proceedings of the IEEE International Electron Devices Meeting (IEDM), Baltimore, December 7–9, 2009.Google Scholar
Stoney, G. G., 1909, “The tension of metallic films deposited by electrolysis,” Proc. R. Soc. London, Ser. A, 82, pp. 172–175.Google Scholar
Ishihara, T., Suzuki, K., Suwazono, S., Hirata, M., and Tanigawa, H., “CMOS integrated silicon pressure sensor,” IEEE Journal of Solid-State Circuits, vol. 22, no. 2, pp. 151–156, April 1987.Google Scholar
Yoon, E. and Wise, K. D., “An integrated mass flow sensor with on-chip CMOS interface circuitry,” IEEE Transactions on Electron Devices, vol. 39, no. 6, pp. 1376–1386, June 1992.Google Scholar
Burghartz, J. N., Ultra-thin Chip Technology and Applications. Springer, 2011.CrossRefGoogle Scholar
Gupta, S., Navaraj, W. T., Lorenzelli, L., and Dahiya, R., “ Ultra-thin chips for high-performance flexible electronics,” npj Flexible Electronics, vol. 2, no. 1, March 2018.Google Scholar
Pan, S., Luo, Y., Heidary Shalmany, S., and Makinwa, K. A. A., “A resistor-based temperature sensor with a 0.13 pJ ∙ K2 resolution FoM,” IEEE Journal of Solid-State Circuits, vol. 53, no. 1, pp. 164–173, January 2018.Google Scholar
Harpe, P., “A compact 10-b SAR ADC with unit-length capacitors and a passive FIR filter,” IEEE Journal of Solid-State Circuits, vol. 54, no. 3, pp. 636–645, March 2019.Google Scholar
Son, S. Y. et al., “Strain induced changes in gate leakage current and dielectric constant of nitrided Hf-silicate dielectric silicon MOS capacitors,” App. Physics Letters, vol. 110, July 2011.Google Scholar
Ambiq apollo ultra-low power micrcontroller, product homepage, https://ambiq.com/apollo2/ [online], accessed on July 15, 2021.Google Scholar
Elsobky, M. et al., “Relative humidity sensors for system-in-foil applications,” Proceedings of the MikroSystemTechnik Congress, Munich, pp. 1–3, 2017.Google Scholar
Nagata, M., Nagai, J., Hijikata, K., Morie, T., and Iwata, A., “Physical design guides for substrate noise reduction in CMOS digital circuits,” IEEE Journal of Solid-State Circuits, vol. 36, no. 3, pp. 539–549, March 2001.Google Scholar
Ghanbari, M. M., Tsai, J. M., Nirmalathas, A., Muller, R., and Gambini, S., “An energy-efficient miniaturized intracranial pressure monitoring system,” IEEE Journal of Solid-State Circuits, vol. 52, no. 3, pp. 720–734, March 2017.Google Scholar
Marien, H., Steyaert, M. S. J., van Veenendaal, E., and Heremans, P., “A fully integrated ∆Σ ADC in organic thin-film transistor technology on flexible plastic foil,” IEEE Journal of Solid-State Circuits, vol. 46, no. 1, pp. 276–284, January 2011.Google Scholar
Garripoli, C. et al., “15.3 an a-IGZO asynchronous delta-sigma modulator on foil achieving up to 43 dB SNR and 40 dB SNDR in 300 Hz bandwidth,” 2017 IEEE International Solid-State Circuits Conference (ISSCC), pp. 260–261, 2017. doi: 10.1109/ISSCC.2017.7870360.Google Scholar
Grzesiak, A., Becker, R., and Verl, A., “The bionic handling assistant, a success story of additive manufacturing,” Assembly Automation, vol. 31, pp. 329–333, 2011.Google Scholar
IMS CHIPS projects overview including kosif project, https://www.ims-chips.de/?page_id=392 [online], accessed on July 15, 2021.Google Scholar
Harendt, C. et al., “Hybrid system in foil (HYSiF) exploiting ultra-thin flexible chips,” Proceedings of the European Solid State Device Research Conference, pp.210–213, 2014.Google Scholar
Product Website. [online]. http://www.ti.com/product/CC1352R, accessed on October 4, 2019.Google Scholar
Reinisch, H. et al., “A multifrequency passive sensing tag with on-chip temperature sensor and off-chip sensor interface using EPC HF and UHF RFID technology,” IEEE Journal of Solid-State Circuits, vol. 46, no. 12, pp. 3075–3088, December 2011.Google Scholar
Deepu, C. J., Zhang, X., Liew, W., Wong, D. L. T., and Lian, Y., “An ECG-on-chip with 535 nw/channel integrated lossless data compressor for wireless sensors,” IEEE Journal of Solid-State Circuits, vol. 49, no. 11, pp. 2435–2448, November 2014.Google Scholar
Product Website. [online]. https://www.infineon.com/cms/en/product/security-smart-card-solutions/optiga-embedded-security-solutions, accessed on October 4, 2019.Google Scholar
Product Website. [online]. https://www.emmicroelectronic.com/expertise/communication/rfid, accessed on October 4, 2019.Google Scholar
Nguyen, T. T. et al., “A flexible bimodal sensor arrays for simultaneous sensing of pressure and temperature,” Advance Materials, vol. 26, pp. 796-804, Febraury 2014.Google Scholar
Wolf, J. et al., “Ultra-thin silicon chips in flexible microsystems,” Proceedings of the 13th Electronic Circuits World Convention ECWC, Nuremberg, May 2014.Google Scholar
Boudaden, J. et al., “Polyimide-based capacitive humidity sensor,” Sensors, vol. 18, no. 2, 2018.Google Scholar
Rivadeneyra, A. et al., “Printed electrodes structures as capacitive humidity sensors: A comparison,” Sensors and Actuators A: Physical, vol. 244, pp. 56–65, June 2016.Google Scholar
Zhu, Z., Yang, G., Li, R., and Pan, T., “Photopatternable PEDOT:PSS/PEG hybrid thin film with moisture stability and sensitivity,” Microsystems & Nanoengineering, vol. 3, 2017.Google Scholar
Morais, R. M., M. d. Klem, S., Nogueira, G. L., Gomes, T. C., and Alves, N., “Low cost humidity sensor based on PANI/PEDOT:PSS printed on paper,” IEEE Sensors Journal, vol. 18, no. 7, pp. 2647–2651, April, 2018.Google Scholar
Leng, X., Li, W., Luo, D., and Wang, F., “Differential structure with graphene oxide for both humidity and temperature sensing,” IEEE Sensors Journal, vol. 17, no. 14, pp. 4357–4364, July, 2017.Google Scholar
Ghosh, S., Ghosh, R., Guha, P. K., and Bhattacharyya, T. K., “Humidity sensor based on high proton conductivity of graphene oxide,” IEEE Transactions on Nanotechnology, vol. 14, no. 5, pp. 931–937, September 2015.Google Scholar
Bi, H. et al., “Ultrahigh humidity sensitivity of graphene oxide,” Scientific Reports, vol. 3, September 2013.Google Scholar
Guo, H. et al., “Transparent, flexible, and stretchable WS2 based humidity sensors for electronic skin,” Nanoscale, vol. 9, pp. 6246–6253, 2017.Google Scholar
Qian, J. et al., “Positive impedance humidity sensors via single-component materials,” Scientific Reports, vol. 6, May 2016.Google Scholar
Phan, D., Park, I., Park, A., Park, C., and Jeon, K., “Black P/graphene hybrid: A fast response humidity sensor with good reversibility and stability,” Scientific Reports, vol. 7, September 2017.Google Scholar
Mogera, U., Sagade, A. A., George, J. S., and Kulkarni, U. G., “Ultrafast response humidity sensor using supramolecular nanofibre and its application in monitoring breath humidity and flow,” Scientific Reports, vol. 4, February 2014.Google Scholar
Khan, M. U., Hassan, G., and Bae, J., “Bio-compatible organic humidity sensor based on natural inner egg shell membrane with multilayer crosslinked fiber structure,” Scientific Reports, vol. 9, 5824 (2019), April 2019. https://doi.org/10.1038/s41598-019-42337-0.Google Scholar
Rausch, J., Salun, L., Grieheimer, S., and Ibis, R. W. M., “Printed piezoresistive strain sensors for monitoring of light-weight structures,” Proceedings of SENSOR+TEST Conferences, pp. 216–221, 2011. doi: https://doi.org/10.5162/sensor11/b1.3.Google Scholar
Dionisi, A., Borghetti, M., Sardini, E., and Serpelloni, M., “Biocompatible inkjet resistive sensors for biomedical applications,” Proceedings of the IEEE International Instrumentation and Measurement Technology Conference, pp. 1629–1633, 2014. doi: https://doi.org/10.1109/I2MTC.2014.6861021.Google Scholar
Raiteri, D., Lieshout, P. v., Roermund, A. v., and Cantatore, E., “An organic VCO-based ADC for quasi-static signals achieving 1LSB INL at 6b resolution,” 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers, pp. 108–109, 2013. doi: https://doi.org/10.1109/ISSCC.2013.6487658.CrossRefGoogle Scholar
- 1
- Cited by