31 results
Medium-Range Structure of Zr-Cu-Al Bulk Metallic Glasses from Structural Refinement Based on Fluctuation Microscopy
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- Microscopy and Microanalysis / Volume 21 / Issue S3 / August 2015
- Published online by Cambridge University Press:
- 23 September 2015, pp. 1659-1660
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- August 2015
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Electron Correlation Microscopy: A New Technique for Studying Local Atom Dynamics Applied to a Supercooled Liquid
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- Microscopy and Microanalysis / Volume 21 / Issue 4 / August 2015
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- 03 June 2015, pp. 1026-1033
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- August 2015
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Understanding stress gradients in microelectronic metallization
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- Powder Diffraction / Volume 27 / Issue 2 / June 2012
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- 15 June 2012, pp. 92-98
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Stress gradients observed in Cu thin films induced by capping layers
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- Journal of Materials Research / Volume 25 / Issue 4 / April 2010
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- 31 January 2011, pp. 622-628
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- April 2010
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Stress Gradients Observed in Cu Thin Films Induced by Capping Layers
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- MRS Online Proceedings Library Archive / Volume 1156 / 2009
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- 31 January 2011, 1156-D05-04
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- 2009
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Effects of BEOL Stack on Thermal Mechanical Stress of Cu Lines
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- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F08-01
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- 2006
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Process-Oriented Stress Modeling and Stress Evolution During Cu/Low-K BEOL Processing
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- MRS Online Proceedings Library Archive / Volume 812 / 2004
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- 17 March 2011, F1.8
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- 2004
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Mechanical strain evolution in Cu/low K interconnect lines
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- MRS Online Proceedings Library Archive / Volume 795 / 2003
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- 01 February 2011, U1.1
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- 2003
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Silicides for the 65 nm Technology Node
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- MRS Online Proceedings Library Archive / Volume 766 / 2003
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- 01 February 2011, E10.1
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- 2003
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Crystallographic Texture Characterization of Inlaid Copper Interconnects
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- MRS Online Proceedings Library Archive / Volume 672 / 2001
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- 21 March 2011, O7.9
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- 2001
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Mechanical Stress Measurements in Damascene-Fabricated Aluminum Interconnect Lines
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- MRS Online Proceedings Library Archive / Volume 594 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 433
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- 1999
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Mechanical Stresses in Aluminum and Copper Interconnect Lines for 0.18µm Logic Technologies
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- MRS Online Proceedings Library Archive / Volume 563 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 189
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- 1999
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X-Ray Diffraction Determination of Texture and Stress in Damascene Fabricated Copper Interconnects
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- MRS Online Proceedings Library Archive / Volume 563 / 1999
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- 10 February 2011, 201
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- 1999
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The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects
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- MRS Online Proceedings Library Archive / Volume 473 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 217
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- 1997
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The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects
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- MRS Online Proceedings Library Archive / Volume 472 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 313
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- 1997
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Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines
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- Journal of Materials Research / Volume 11 / Issue 1 / January 1996
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- 31 January 2011, pp. 184-193
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- January 1996
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Elastic strain gradients and x-ray line broadening effects as a function of temperature in aluminum thin films on silicon
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- Journal of Materials Research / Volume 9 / Issue 2 / February 1994
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- 03 March 2011, pp. 328-335
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- February 1994
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Effect of CU and SI in Aluminum on Stress Change and on TiAl3 Formation in Al Alloy/TI Bilayer Films During Annealing
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- MRS Online Proceedings Library Archive / Volume 356 / 1994
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- 21 February 2011, 471
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- 1994
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Measurement and Interpretation of Strain Relaxation in Passivated Al-0.5%Cu Lines
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- MRS Online Proceedings Library Archive / Volume 338 / 1994
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- 22 February 2011, 275
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- 1994
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The Effect of Si ON TiAl3 Formation EV Ti/Al Alloy Bilayers
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- MRS Online Proceedings Library Archive / Volume 355 / 1994
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- 21 February 2011, 631
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- 1994
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