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Rapid Cure Of Liquid Encapsulants And Structural Adhesives For Electronics Packaging Using Variable Frequency Microwave (Vfm) Energy
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- Journal:
- MRS Online Proceedings Library Archive / Volume 445 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 125
- Print publication:
- 1996
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- Article
- Export citation