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Mechanical Behavior of the Patterned Copper Lines
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- Journal:
- Microscopy and Microanalysis / Volume 12 / Issue S02 / August 2006
- Published online by Cambridge University Press:
- 31 July 2006, pp. 946-947
- Print publication:
- August 2006
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Activation Energy of Electromigration in Copper Thin Film Conductor Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 428 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 55
- Print publication:
- 1996
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Activation Energy of Electromigration in Copper Thin Film Conductor Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 121
- Print publication:
- 1996
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Grain Boundary Migration and Grain Growth Induced by Electromigration in Copper and Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 283
- Print publication:
- 1995
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