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Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures
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- Journal:
- Journal of Materials Research / Volume 10 / Issue 4 / April 1995
- Published online by Cambridge University Press:
- 03 March 2011, pp. 1028-1037
- Print publication:
- April 1995
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Low Stress, High Resolution Photosensitive Polyimide Based on a BPDA/PDA/6FDAm Copolymer
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- Journal:
- MRS Online Proceedings Library Archive / Volume 323 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 259
- Print publication:
- 1993
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