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Dealing With Multiple Grains in TEM Lamellae Thickness for Microstructure Analysis Using Scanning Precession Electron Diffraction
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- Journal:
- Microscopy and Microanalysis / Volume 21 / Issue S3 / August 2015
- Published online by Cambridge University Press:
- 23 September 2015, pp. 1243-1244
- Print publication:
- August 2015
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Three-Dimensional Semiconductor Device Investigation Using Focused Ion Beam and Scanning Electron Microscopy Imaging (FIB/SEM Tomography)
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- Journal:
- Microscopy and Microanalysis / Volume 19 / Issue 1 / February 2013
- Published online by Cambridge University Press:
- 25 January 2013, pp. 85-92
- Print publication:
- February 2013
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Advanced FIB-based sample preparation for 3D characterization of 45nm ICs
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- Journal:
- Microscopy and Microanalysis / Volume 14 / Issue S2 / August 2008
- Published online by Cambridge University Press:
- 03 August 2008, pp. 1002-1003
- Print publication:
- August 2008
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