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Dealing With Multiple Grains in TEM Lamellae Thickness for Microstructure Analysis Using Scanning Precession Electron Diffraction

Published online by Cambridge University Press:  23 September 2015

A. Valery ,
E. F. Rauch ,
A. Pofelski ,
L. Clement  and
F. Lorut
A. Valery
Affiliation:
STMicroelectronics, 850 rue Jean Monnet, F-38920 Crolles, France SIMAP/GPM2 laboratory, 101 rue de la Physique, 38402 Saint Martin d’Heres, France
E. F. Rauch
Affiliation:
SIMAP/GPM2 laboratory, 101 rue de la Physique, 38402 Saint Martin d’Heres, France
A. Pofelski
Affiliation:
STMicroelectronics, 850 rue Jean Monnet, F-38920 Crolles, France
L. Clement
Affiliation:
STMicroelectronics, 850 rue Jean Monnet, F-38920 Crolles, France
F. Lorut
Affiliation:
STMicroelectronics, 850 rue Jean Monnet, F-38920 Crolles, France

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 21 , Supplement S3: Proceedings of Microscopy & Microanalysis 2015 , August 2015 , pp. 1243 - 1244
Copyright
Copyright © Microscopy Society of America 2015 

References

[1] Randle, V., Materials Characterization 60 (2009). p 913–922.Google Scholar
[2] Rauch, E. F. & Veron, M., Materials Characterization 98 (2014). p 1–9.Google Scholar
[3] Valery, A., et al, International Microscopy Congress Proceedings (2014). p 3205–3206.Google Scholar
[4] Rabadanov, M. Kh. & Ataev, M. B., Inorganic Materials 38 (2002). p 120–123.Google Scholar