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Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
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- Journal:
- Journal of Materials Research / Volume 22 / Issue 3 / March 2007
- Published online by Cambridge University Press:
- 03 March 2011, pp. 763-769
- Print publication:
- March 2007
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- Article
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