Radiation hard monolithic particle sensors can be fabricated by a vertical integration of amorphous silicon particle sensors on top of CMOS readout chip. Two types of such particle sensors are presented here using either thick diodes or microchannel plates. The first type based on amorphous silicon diodes exhibits high spatial resolution due to the short lateral carrier collection. Combination of an amorphous silicon thick diode with microstrip detector geometries permits to achieve micrometer spatial resolution beneficial for high accuracy beam positioning. Microchannel plates based on amorphous silicon were successfully fabricated and multiplication of electrons was observed. This material may solve some of the problems related to conventional microchannel devices. Issues, potential and limits of these detectors are presented and discussed.

In thin film silicon solar cell technology, annealing (heat treatment) effects are of interest since (i) annealing of underlying films often cannot be avoided during deposition and (ii) heat treatment (e.g. by laser) may be actively used for improvement of as-deposited material. Changes in the microstructure of several thin film silicon solar cell materials like hydrogenated amorphous silicon, microcrystalline silicon and zinc oxide by heat treatment were investigated by effusion measurements of hydrogen and implanted helium. Densification is observed for all materials studied, i.e. interconnected voids disappear or are transformed to isolated voids. We attribute the observed annealing effects primarily to an incomplete polymerization during growth. Important for solar cell processing is the result that the annealing effects involving structural changes set in at temperatures close to the temperature of deposition.

We present a novel ZnO:Al fabrication process consisting of room-temperature vacuum sputtering followed by an excimer laser annealing (ELA). The ELA treatment improves the optical transmission of the films, and the film resistivities (<1 mΩ·cm) remain stable or improve with increasing laser fluence up to 0.6 J/cm2, as the carrier density increases but the carrier mobility is degraded. This process is followed by a standard dilute HCl chemical texturing step, and produces substrates with suitable texture, conductivity, and transparency properties for thinfilm photovoltaic applications. Substrates resulting from this process display elevated haze levels (80% at 600 nm and 50% at 800 nm) after the wet-chemical etching step. Such substrates have been used to make single junction hydrogenated nanocrystalline silicon solar cells, and an increase in the short-circuit current of up to 2.2 mA/cm2 is observed compared to a substrate deposited by a standard room-temperature sputtering + wet-etch process. This gain is primarily due to increased photo-response in the red due to improved light-scattering, as at wavelengths greater than 600 nm, a gain in photocurrent of up to 1.7 mA/cm2 is observed.

In this paper, we report on the growth and fabrication of thin film Si photovoltaic devices on photonic structures which were fabricated on steel and PEN and Kapton substrates. Both amorphous Si and thin film nanocrystalline Si devices were fabricated. The 2 dimensional photonic reflector structures were designed using a scattering matrix theory and consisted of appropriately designed holes/pillars which were imprinted into a polymer layer coated onto PEN, Kapton and stainless steel substrates. The photonic structures were coated with a thin layer of Ag and ZnO. Both single junction and tandem junction (amorphous/amorphous and amorphous/nanocrystalline) cells were fabricated on the photonic layers. It was observed that the greatest increase in short circuit current and efficiency in these cells due to the use of photonic reflectors was in nanocrystalline Si cells, where an increase in current approaching 30% (compared to devices fabricated on flat substrates) was obtained for thin (∼ 1 micrometer thick i layers) films of nano Si deposited on steel structures. The photonic structures (which were nanoimprinted into a polymer) were shown to stand up to temperatures as large as 300 C, thereby making such structures practical when a steel (or glass) of kapton substrate is used. Detailed measurements and discussion of quantum efficiency and device performance for various photonic back reflector structures on steel, kapton and PEN substrates will be presented in the paper.

Due to the increasing complexity of thin-film silicon solar cells, the role of computer modeling for analyzing and designing these devices becomes increasingly important. The ASA program was used to study two of these advanced devices. The simulations of an amorphous silicon solar cell with silver nanoparticles embedded in a zinc oxide back reflector demonstrated the negative effect of the parasitic absorption in the particles. When using optical properties of perfectly spherical particles a modest enhancement in the external quantum efficiency was found. The simulations of a tandem micromorph solar cell, in which a zinc oxide based photonic crystal-like multilayer was incorporated as an intermediate reflector (IR), demonstrated that the IR resulted in an enhanced photocurrent in the top cell and could be used to optimize the current matching of the top and bottom cell.

We have measured electron drift in amorphous silicon-germanium nip photodiodes using the photocarrier time-of-flight technique. The samples show electron deep-trapping shortly after photogeneration, which is generally attributed to capture by a neutral dangling bond (D0) to form a negatively charged center (D-). An unusual feature is that electron re-emission from the trap is also clearly seen in the transients. Temperature-dependent measurements on the emission yield an activation energy of about 0.8 eV and the remarkably large value of 1015 Hz for the emission prefactor frequency. We also compiled results on electron emission from deep traps in a-Si:H, a-SiGe:H, and a-SiC:H from six previous publications. Collectively, these measurements exhibit "Meyer Neldel" behavior for electron emission over a range of activation energies from 0.2–0.8 eV and a prefactor range extending over nine decades, from 106 to 1015 Hz. The Meyer-Neldel behavior is consistent with the predictions of the multi-excitation entropy model. We extract a ionization entropy of 20kB from the measurements, which is very large compared to crystal silicon. We discuss this result in terms of a bond charge model.

We successfully fabricated a-IGZO TFTs employing a Ti/Cu source/drain (S/D) and SiNx passivation in order to reduce the line-resistance, as compared to most oxide TFTs that use Mo (or TCO) and SiO2 for their S/D and passivation, respectively. Although passivated with SiNx, the TFT exhibits good transfer characteristics without a negative shift. However, the TFT employing a Mo S/D exhibited conductor-like characteristics when passivated with SiNx. Our investigation suggests that the IGZO oxygen vacancies found in the Ti/Cu S/D are controlled, resulting in low concentrations, and so prevent the SiNx-passivated TFT from having a negative shift.

We have developed optical models for the characterization of grain size in nanocrystal thin films embedded in SiO2 and fabricated using low pressure chemical vapor deposition of Si from silane on a quartz substrate, followed by thermal oxidation. The as-grown nanocrystals thin film on quartz was composed of a two-dimensional array of Si nanocrystals (Si-NC) showing columnar structure in the z-direction and touching each other in the x-y plane. The nanocrystal size in the z-direction was equal to the Si nanocrystal film thickness, changing by the deposition time, while their x-y size was almost equal in all the samples, with small size dispersion. After high temperature thermal oxidation, a thin silicon oxide film was formed on top of the nanocrystals layer. The aim of this work was to measure the grain size and the nanocrystallinity of the Si nanocrystal thin films, a quantity related to the change of the dielectric function. We used a definition for the nanorcystallinity that is related to the effective medium analysis (EMA) of the material. The optical technique used for the investigations was spectroscopic ellipsometry. To measure the above sample properties the thickness and composition of several layers on a quartz substrate had to be determined by proper modeling of this complex system. We found that the nanocrystallinity (defined as the ratio of nc-Si/(c-Si+nc-Si) decreases systematically with increasing the Si-NC layer thickness. Using this approach we are sensitive to the lifetime broadening of electrons caused by the scattering on the grain boundaries, and not to the shift of the direct interband transition energies due to quantum confinement.

The effect of the rapid thermal annealing (RTA) and hydrogenation step on the electronic properties of the n+ and p+ solid phase crystallized (SPC) poly-crystalline silicon (poly-Si) thin films was investigated using Hall effect measurements and four-point-probe measurements. Both the RTA and hydrogenation step were found to affect the electronic properties of doped poly-Si thin films. The RTA step was found to have the largest impact on the dopant activation and majority carrier mobility of the p+ SPC poly-Si thin films. A very high Hall mobility of 71 cm2/Vs for n+ poly-Si and 35 cm2/Vs for p+ poly-Si at the carrier concentration of 2×1019 cm-3 and 4.5×1019 cm-3, respectively, were obtained.