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High Frequency, High Density Interconnect Using AC Coupling
Published online by Cambridge University Press: 01 February 2011
Abstract
AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 75 μm and signaling rates greater than 5 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches, status, and discusses material issues important to performance.
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- Research Article
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- Copyright © Materials Research Society 2004