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2D Junction Profiling on Semiconductor Device Reliability Fail

Published online by Cambridge University Press:  04 August 2017

Y.Y. Wang ,
J. Nxumalo ,
A. Katnani ,
D. Ioannou ,
J. Brown ,
K. Bandy ,
M. Macdonald  and
J. Bruley
Y.Y. Wang
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
J. Nxumalo
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
A. Katnani
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
D. Ioannou
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
J. Brown
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
K. Bandy
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
M. Macdonald
Affiliation:
Globalfoundires Inc. Hudson Valley Research Park, 2070 Route 52, Hopewell Jct., NY, USA
J. Bruley
Affiliation:
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Route 134, Yorktown Heights, NY, USA

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 23 , Supplement S1: Proceedings of Microscopy & Microanalysis 2017 , July 2017 , pp. 1510 - 1511
Copyright
© Microscopy Society of America 2017 

References

[1] Wang, Y.Y., etal, Ultramicroscopy 101 2004). p. 63.Google Scholar
[2] Wang, Y.Y., et al, US patent: US 7,015,469 B2 (2006).Google Scholar
[3] Wang, Y.Y., et al, JEOL News 47 2012). p. 9.Google Scholar
[4] Wang, Y.Y., et al, Ultramicroscopy 124 2013). p. 117.Google Scholar
[5] Williams, C. C., et al, J. Vac. Sci. Technol. A 8 1990). p. 895.CrossRefGoogle Scholar
[6] Yuan Tour, Semiconductor device Physics.Google Scholar