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Dependence of fracture stress on applied stress rate in a Yb2O3–SiO2-doped hot-pressed silicon nitride ceramic

Published online by Cambridge University Press:  31 January 2011

Shuqi Guo ,
Naoto Hirosaki ,
Yoshinobu Yamamoto ,
Toshiyuki Nishimura  and
Mamoru Mitomo
Shuqi Guo*
Affiliation:
Advanced Materials Laboratory, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan
Naoto Hirosaki
Affiliation:
Advanced Materials Laboratory, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan
Yoshinobu Yamamoto
Affiliation:
Advanced Materials Laboratory, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan
Toshiyuki Nishimura
Affiliation:
Advanced Materials Laboratory, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan
Mamoru Mitomo
Affiliation:
Advanced Materials Laboratory, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

High-temperature fracture behavior of a Yb2O3–SiO2–doped hot-pressed silicon nitride (Si3N4) ceramic was investigated in four-point flexure between 1000 and 1500 °C at five crosshead speeds, using the specimens precracked with three indentation loads. Above 1000 °C, a temperature and stressing rate dependence of fracture stress was seen. At 1200 °C the fracture stress of the precracked specimens increased with decreasing stressing rates due to a toughening effect, the absence of slow crack growth (SCG). However, at 1400 and 1500 °C the fracture stress decreased with decreasing stressing rate. In particular, this dependence was stronger at 1500 °C than at 1400 °C. The SCG was observed only in the specimens precracked with indentation loads of 98 and 196 N. This crack extended with increasing test temperature and/or decreasing stressing rate. The dependence of fracture stress on stressing rate was attributed to a SCG behavior at higher temperatures.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 11 , November 2001 , pp. 3254 - 3261
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1.Hoffmann, M.J., High-Temperature Properties of Yb-Containing Si3N4 in Tailoring of Mechanical Properties of Si3N4 Ceramics, edited by Hoffmann, M.J. and Petzow, G. (Kluwer Academic Publishers, Dordrecht, The Netherlands, 1994), pp. 233–244.CrossRefGoogle Scholar
2.Kleebe, H.J., Pezzotti, G., and Ziegler, G., J. Am. Ceram. Soc. 82, 1857 (1999).CrossRefGoogle Scholar
3.Park, H., Kim, H.E., and Niihara, K., J. Am. Ceram. Soc. 80, 750 (1997).CrossRefGoogle Scholar
4.Cinibulk, M.K., Thomas, G., and Johnson, S.M., J. Am. Ceram. Soc. 75, 2050 (1992).CrossRefGoogle Scholar
5.Cracmpon, J., Duclos, R., Peni, F., Guicciardi, S., and Portu, G.D., J. Am. Ceram. Soc. 80, 85 (1997).CrossRefGoogle Scholar
6.Lange, F.F., J. Am. Ceram. Soc. 57, 84 (1974).CrossRefGoogle Scholar
7.Tanaka, I. and Pezzotti, G., J. Am. Ceram. Soc. 75, 772 (1992).CrossRefGoogle Scholar
8.Klemm, H. and Pezzotti, G., J. Am. Ceram. Soc. 77, 553 (1994).CrossRefGoogle Scholar
9.Knickerbocker, S.H., Zangvil, A., and Brown, S.D., J. Am. Ceram. Soc. 68, C-99 (1985).Google Scholar
10.Charles, R.J., J. Appl. Phys. 29, 1549 (1958).CrossRefGoogle Scholar
11.Evans, A.G. and Johnson, H., J. Mater. Sci. 10, 214 (1975).CrossRefGoogle Scholar
12.Nishimura, T. and Mitomo, M., J. Mater. Res. 10, 240 (1995).CrossRefGoogle Scholar
13.Nishimura, T., Mitomo, M., and Suematsu, H., J. Mater. Res. 12, 203 (1997).CrossRefGoogle Scholar
14.Maloy, S., Heuer, A.H., Lewandowski, J., and Petrovic, J., J. Am. Ceram. Soc. 74, 2704 (1991).CrossRefGoogle Scholar
15.Petrovic, J.J., Bhattacharya, A.K., Honnell, R.E., Mitchell, T.E., Wade, R.K., and McClellan, K.J., Mater. Sci. Eng. A 155, 259 (1992).CrossRefGoogle Scholar
16.Knickerbocker, S.H., Zangvil, A., and Brown, S.D., J. Am. Ceram. Soc. 67, 365 (1984).CrossRefGoogle Scholar