This paper outlines a procedure for assessing the quality of failure explanations in engineering failure analysis. The procedure structures the information contained in explanations such that it enables to find weak points, to compare competing explanations, and to provide redesign recommendations. These features make the procedure a good asset for critical reflection on some areas of the engineering practice of failure analysis and redesign. The procedure structures relevant information contained in an explanation by means of structural equations so as to make the relations between key elements more salient. Once structured, the information is examined on its potential to track counterfactual dependencies by offering answers to relevant what-if-things-had-been-different questions. This criterion for explanatory goodness derives from the philosophy of science literature on scientific explanation. The procedure is illustrated by applying it to two case studies, one on Failure Analysis in Mechanical Engineering (a broken vehicle shaft) and one on Failure Analysis in Civil Engineering (a collapse in a convention center). The procedure offers failure analysts a practical tool for critical reflection on some areas of their practice while offering a deeper understanding of the workings of failure analysis (framing it as an explanatory practice). It, therefore, allows to improve certain aspects of the explanatory practices of failure analysis and redesign, but it also offers a theoretical perspective that can clarify important features of these practices. Given the programmatic nature of the procedure and its object (assessing and refining explanations), it extends work on the domain of computational argumentation.

Optical Photothermal Infrared (O-PTIR) spectroscopy is a new technique for measuring submicron spatial resolution IR spectra with little or no sample preparation. This speeds up analysis times benefiting high-volume manufacturers through gaining insight into process contamination that occurs during development and on production lines. The ability to rapidly obtain far-field non-contact IR spectra at high spatial resolution facilitates the chemical identification of small organic contaminants that are not possible to measure with conventional Fourier transform infrared (FT-IR) microspectroscopy. The unique pump-probe system architecture also facilitates submicron simultaneous IR + Raman microscopy from the same spot with the same spatial resolution. With these unique capabilities, O-PTIR is finding utilization in the high-volume and high-value industries of high-tech componentry (memory storage, electronics, displays, etc.).

Recent advances in early stage failure analysis approaches have introduced behavioral network analysis (BNA), which applies a network-based model of a complex engineered system to detect the system-level effect of ‘local’ failures of design variables and parameters. Previous work has shown that changes in microscale network metrics can signify system-level performance degradation. This article introduces a new insight into the influence of the community structure of the behavioral network on the failure tolerance of the system through the role of bridging nodes. Bridging nodes connect a community of nodes in a system to one or more nodes or communities outside of the community. In a study of forty systems, it is found that bridging nodes, under attack, are associated with significantly larger system-level behavioral degradation than non-bridging nodes. This finding indicates that the modularity of the behavioral network could be key to understanding the failure tolerance of the system and that parameters associated with bridging nodes between modules could play a vital role in system degradation.

The xenon plasma focused ion beam instrument (PFIB), holds significant promise in expanding the applications of focused ion beams in new technology thrust areas. In this paper, we have explored the operational characteristics of a Tescan FERA3 XMH PFIB instrument with the aim of meeting current and future challenges in the semiconductor industry. A two part approach, with the first part aimed at optimizing the ion column and the second optimizing specimen preparation, has been undertaken. Detailed studies characterizing the ion column, optimizing for high-current/high mill rate activities, have been described to support a better understanding of the PFIB. In addition, a novel single-crystal sacrificial mask method has been developed and implemented for use in the PFIB. Using this combined approach, we have achieved high-quality images with minimal artifacts, while retaining the shorter throughput times of the PFIB. Although the work presented in this paper has been performed on a specific instrument, the authors hope that these studies will provide general insight to direct further improvement of PFIB design and applications.

Wire-actuated parallel manipulators and their failures are studied in this paper taking into consideration their failure modes. A methodology for investigating the effect of wire/actuator failures on the force/moment capability of manipulators is presented, and the criteria for full and partial recovery from these failures are established. The methodology is also applicable for the cases that the minimum norm solution for the vector of wire tensions gives a negative value for tension by treating the corresponding wire as failed. The proposed criteria are also valid for the manipulators that utilize hybrid actuation of wires and joints. Three planar wire-actuated parallel manipulators are used as the case study to illustrate the proposed methodology and criteria.

In Integrated Circuits failure analysis excessive power supply current flowing into the IC is often used to indicate the presence of a faulty device. Location of these faulty devices can be problematic as the devices are often buried under several layers of conducting interconnect. By imaging the magnetic field produced by current flowing in an IC a faulty device can be located. In this paper we present experimental results on imaging current-carrying faults on integrated circuits using Magnetic force microscopy. We have experimentally determined that MFM is capable of measuring currents as small as 1 to 10 microampere on ICs in a 30 Hz bandwidth. We have carried out modeling calculations comparing the simulation results with experimental results using realistic MFM tip geometry. From these results we have devised a method to accurately locate the position of the internal current carrying faults from MFM images with micrometer uncertainty.

The development of the electron microprobe by Raymond Castaing provided a great stimulus to materials science at a critical time in its history. For the first time, accurate elemental analysis could be performed with a spatial resolution of 1 µm, well within the dimensions of many microstructural features. The impact of the microprobe occurred across the entire spectrum of materials science and engineering. Contributions to the basic infrastructure of materials science included more accurate and efficient determination of phase diagrams and diffusion coefficients. The study of the microstructure of alloys was greatly enhanced by electron microprobe characterization of major, minor, and trace phases, including contamination. Finally, the electron microprobe has proven to be a critical tool for materials engineering, particularly to study failures, which often begin on a micro-scale and then propagate to the macro-scale with catastrophic results.