This report summarizes a recent study demonstrating simple and rapid synthesis of a new Al–Mg alloy system and ultimately synthesizing a metal matrix nanocomposite, which was achieved by processing stacked disks of the two dissimilar metals by conventional high-pressure torsion (HPT) processing. The synthesized Al–Mg alloy system exhibits exceptionally high hardness through rapid diffusion bonding and simultaneous nucleation of intermetallic phases with increased numbers of HPT turns through 20, and improved plasticity was demonstrated by increasing strain rate sensitivity in the alloy system after post-deformation annealing. An additional experiment demonstrated that the alternate stacking of high numbers of dissimilar metal disks may produce a faster metal mixture during HPT. Metal combinations of Al–Cu, Al–Fe, and Al–Ti were processed by the same HPT procedure from separate pure metals to examine the feasibility of the processing technique. The microstructural analysis confirmed the capability of HPT for the formation of heterostructures across the disk diameters in these processed alloy systems. The HPT processing demonstrates a considerable potential for the joining and bonding of dissimilar metals at room temperature and the expeditious fabrication of a wide range of new metal systems.

Disks of commercial Al-1050 and ZK60A alloys were stacked together and then processed by conventional high-pressure torsion (HPT) through 1 and 5 turns at room temperature to investigate the synthesis of an Al–Mg alloy system. Measurements of microhardness and observations of the microstructures and local compositions after processing through 5 turns revealed the formation of an ultrafine multi-layered structure in the central region of the disk but with an intermetallic β-Al3Mg2 phase in the form of nano-layers in the nanostructured Al matrix near the edge of the disk. The activation energy for diffusion bonding of the Al and Mg phases was estimated and it is shown that this value is low and consistent with surface diffusion due to the very high density of vacancy-type defects introduced by HPT processing. The results demonstrate a significant potential for making use of HPT processing in the preparation of new alloy systems.

Diffusion bonding of TiAl alloys can be enhanced by the use of reactive nanolayer thin films as interlayers. Using these interlayers, it is possible to reduce the conventional bonding conditions (temperature, time, and pressure) and obtain sound and reliable joints. The microstructural characterization of the diffusion bond interfaces is a fundamental step toward understanding and identifying the bonding mechanisms and relating them to the strength of the joints. The interface of TiAl samples joined using Ni/Al nanolayers was characterized by transmission electron microscopy and scanning transmission electron microscopy. Microstructural characterization of the bond revealed that the interfaces consist of several thin layers of different composition and grain size (nanometric and micrometric). The bonding temperature (800, 900, or 1,000°C) determines the grain size and thickness of the layers present at the interface. Phase identification by high-resolution transmission electron microscopy combined with fast Fourier transform and electron energy-loss spectroscopy analyses reveals the presence of several intermetallic compounds: AlTiNi, NiAl, and Al2TiNi. For bonds produced at 800 and 900°C, nanometric grains of Ti were detected at the center of the interface.