4 results
Novel Method for Preparing Transmission Electron Microscopy Samples of Micrometer-Sized Powder Particles by Using Focused Ion Beam
- Part of
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- Journal:
- Microscopy and Microanalysis / Volume 23 / Issue 5 / October 2017
- Published online by Cambridge University Press:
- 13 September 2017, pp. 1055-1060
- Print publication:
- October 2017
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Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples
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- Journal:
- Journal of Materials Research / Volume 21 / Issue 7 / July 2006
- Published online by Cambridge University Press:
- 01 July 2006, pp. 1849-1856
- Print publication:
- July 2006
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Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B10.1
- Print publication:
- 2005
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- Article
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Creep Resistant Solders for Packaging in Optical Communication Devices
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- Journal:
- MRS Online Proceedings Library Archive / Volume 531 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 83
- Print publication:
- 1998
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