8 results
Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Sulfate
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- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K1.4
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- 2004
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The Application of Chemical Mechanical Polishing for Nickel Used in MEMS Devices
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- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K7.5
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- 2004
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The pH Effect On Chemical Mechanical Planarization Of Copper
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- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F6.6
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- 2003
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Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent
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- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F6.10
- Print publication:
- 2003
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Selectivity Studies On Tantalum Barrier Layer In Copper CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F6.3
- Print publication:
- 2003
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Quality Assurance Evaluation of Thermal Barrier Coatings by Electrochemical Impedance Spectroscopy
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- Journal:
- MRS Online Proceedings Library Archive / Volume 645 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, M8.6.1
- Print publication:
- 2000
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Post-Exposure Evaluation of Thermal Barrier Coatings by Electrochemical Impedance Spectroscopy
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- Journal:
- MRS Online Proceedings Library Archive / Volume 645 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, M9.2.1
- Print publication:
- 2000
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XPS and Electrochemical Studies on Tungsten-Oxidizer Interaction in Chemical Mechanical Polishing
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- Journal:
- MRS Online Proceedings Library Archive / Volume 566 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 89
- Print publication:
- 1999
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