2 results
Material Removal Mechanisms of Oxide and Nitride CMP with Ceria and Silica-Based Slurries - Analysis of Slurry Particles Pre- and Post-Dielectric CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K9.2
- Print publication:
- 2004
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- Article
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Effect of Ceria Particle-Size Distribution and Pressure Interactions in Chemo-Mechanical Polishing (CMP) of Dielectric Materials
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- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F3.2
- Print publication:
- 2003
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- Article
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