3 results
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B10.8
- Print publication:
- 2005
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Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy
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- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F6.10
- Print publication:
- 2004
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- Article
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Advanced Anodic Bonding Processes For MEMS Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 782 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, A5.80
- Print publication:
- 2003
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- Article
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