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Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device
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- Journal:
- Microscopy and Microanalysis / Volume 23 / Issue 3 / June 2017
- Published online by Cambridge University Press:
- 20 March 2017, pp. 484-490
- Print publication:
- June 2017
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Xe plasma FIB Delayering of IC based on 14 nm node technology
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- Journal:
- Microscopy and Microanalysis / Volume 22 / Issue S3 / July 2016
- Published online by Cambridge University Press:
- 25 July 2016, pp. 56-57
- Print publication:
- July 2016
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Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit
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- Journal:
- Microscopy and Microanalysis / Volume 22 / Issue S3 / July 2016
- Published online by Cambridge University Press:
- 25 July 2016, pp. 196-197
- Print publication:
- July 2016
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