3 results
Modeling the Mechanisms of Cu-Enhanced Median Time to Failure in Al-Cu Interconnects Under Electromigration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 473 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 317
- Print publication:
- 1997
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- Article
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Direct Correlation Between Grain Configuration and Electromigration Damage Development
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- Journal:
- MRS Online Proceedings Library Archive / Volume 428 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 249
- Print publication:
- 1996
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Analysis of Geometrical and Microstructural Effects on Void Formation in Metallization: Observation and Modelling
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- Journal:
- MRS Online Proceedings Library Archive / Volume 428 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 243
- Print publication:
- 1996
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- Article
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