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Update On Synchrotron Radiation TXRF: New Results

Published online by Cambridge University Press:  10 February 2011

S. Brennan ,
P. Pianetta ,
S. Ghosh ,
N. Takaura ,
C. Wiemer ,
A. Fischer-Colbrie ,
S. Laderman ,
A. Shimazaki ,
A. Waldhauer  and
M. A. Zaitz
S. Brennan
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309
P. Pianetta
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309
S. Ghosh
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309
N. Takaura
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309
C. Wiemer
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309
A. Fischer-Colbrie
Affiliation:
Hewlett-Packard Co., Palo Alto, CA 94301
S. Laderman
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309
A. Shimazaki
Affiliation:
IBM Research Laboratory, Hopewell Junction, NY 12533
A. Waldhauer
Affiliation:
Toshiba Corp., Kawasaki., JAPAN
M. A. Zaitz
Affiliation:
Applied Materials, 350 Bowers Ave., Santa Clara, CA 95051
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Abstract

Synchrotron-based total-reflection x-ray fluorescence(SR-TXRF) has been developed as a leading technique for measuring wafer cleanliness. It holds advantages over other techniques in that it is non-destructive and allows mapping of the surface. The highest sensitivity observed thus far is 3x108 atoms/cm 2 (- 3fg) for 1000 second count time. Several applications of SR-TXRF are presented which take advantage of the energy tunability of the synchrotron source or the mapping capability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 524: Symposium V – Application of Synchrotron Radiation Techniques…IV , 1998 , 245
Copyright
Copyright © Materials Research Society 1998

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References

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