Hostname: page-component-78c5997874-t5tsf Total loading time: 0 Render date: 2024-11-17T13:17:18.970Z Has data issue: false hasContentIssue false
  • English
  • Français

Stresses in Multilayered Thin Films on a Thick Substrate

Published online by Cambridge University Press:  28 February 2011

E. Suhir
E. Suhir*
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill New Jersey 07974.
Get access

Abstract

The analysis contains an engineering method for the prediction of thermally induced stresses in single- and multilayered heteroepitaxial structures on a thick substrate. The examined stresses include 1) normal stresses acting in the film layers themselves and responsible for their ultimate and fatigue strength, and 2) interfacial stresses responsible for film blistering and peeling. The developed formulas are simple, visible, easy-to-use, and clearly indicate how material and structural characteristics affect the magnitude and the distribution of stresses and deflections. Some recommendations for smaller stresses in film structures are presented. The obtained results can be utilized as a guidance for an optimal physical design of multilayered heteroepitaxial structures used in Microelectronics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 91: Symposium A – Heteroepitaxy on Silicon II , 1987 , 73
Copyright
Copyright © Materials Research Society 1987

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Reinhart, F. K., and Logan, R. A., J. Appl. Phys., vol. 44, No. 7 (1973).Google Scholar
2. Röll, K., J. Appl. Phys. vol 47, No. 7 (1976).Google Scholar
3. Olsen, G. H., and Ettenberg, M., J. Appl. Phys., vol. 48, No. 6 (1977).Google Scholar
4. Vilms, L., and Kerps, D., J. Appl. Phys., vol. 53, No. 3 (1982).Google Scholar
5. Suhir, E., J. Appl. Mech., vol. 53, No. 3 (1986).Google Scholar
6. Suhir, E., in Electronic Packaging Material Science, edited by Jackson, K. A. et al. (Materials Research Society, Pittsburgh, Pennsylvania, 1986).Google Scholar
7. Suhir, E., in Proceeding of 1986 Int. Symp. on Microelectronics (Int. Soc. for Hybrid Microelectronics, Atlanta, Georgia, 1986).Google Scholar
8. Luryi, S. and Suhir, E., Appl. Phys. Letters, vol. 49, No. 3 (1986).Google Scholar
9. Suhir, E., presented at the 1986 ASME Winter Meeting, Anaheim, Calif., 1986 (unpublished).Google Scholar