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New Patternable Materials for Electronic Packaging

Published online by Cambridge University Press:  15 February 2011

Michael Popall
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-8700 Würzburg, F. R. G.
Jürgen Kappel
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-8700 Würzburg, F. R. G.
Monika Pilz
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-8700 Würzburg, F. R. G.
Jochen Schulz
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-8700 Würzburg, F. R. G.
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Abstract

New inorganic-organic copolymers (ORMOCERs – ORganically MOdified CERamics) were developed as protective coatings for electronic and optical devices, as patternable insulation and passivation layers for electronics, e. g. MCM's, and as possible interconnects and waveguides for micro optics.

Depending on the chemical composition and the processing parameters, their important features are low permittivity constants (eR ≤ 3.2), high bulk resistance (RD > 1016 Ωcm), high dielectric strength (ED ≤ 400 V/μm), refractive index around 1.48, optical transparency in the range of 400 – 1300 nm, and good adhesion to numerous substrates, such as Al2O3, glass, silicon, copper, aluminum, steel, polyimides, polyesters and epoxides.

The materials can be applied using standard technology. They are patterned by laser direct writing, photolithographic, screen printing or embossing technologies.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

[1] Elliot, D. J. (Ed.): Integrated circuit fabrication technology; McGraw-Hill Book Company, New York 1982.Google Scholar
Levy, R.A. (Ed.): Microelectronic Materials and Processes; Kluwer Academic Publishers, Dordrecht 1989.CrossRefGoogle Scholar
[2] Goosey, M.T. (Ed.): Plastics for electronics; Elsevier Applied Science Publishers, London 1985.CrossRefGoogle Scholar
Wang, D.W. in: Electronic Packaging Materials Science III; Jaccodine, R., Jackson, K.A., Sundahl, R.C. (Eds.); Mat. Res. Soc. Symp. Proc. Vol.108, 125 (1988).Google Scholar
Goff, D.L., Yuan, E.L., Long, H., Neuhaus, H.J. in: Polymeric Materials for Electronics Packaging and Interconnection; Lupinski, J.H., Moore, R.S. (Eds.); Am. Chem. Soc. Symp. Series Vol.407, 93 (1989).Google Scholar
Booth, B. L., Journal of Lightwave Technology, Vol.7(10), 1445 (1989).CrossRefGoogle Scholar
[3] Popall, M., Kappel, J., Pilz, M. and Schulz, J., VDI Berichte 933, 139 (1991).Google Scholar
[4] Popall, M., Kappel, J., Pilz, M. and Schulz, J. in: Proc. Eurogel 91, in print.Google Scholar
[5] Davis, J.H. in: Plastics for electronics; Elsevier Applied Science Publishers, London, 67 (1985).Google Scholar
Wong, C.P. in: Polymeric Materials for Electronics Packaging and Interconnection, Lupinski, J.H., Moore, R.S. (Eds.), Am. Chem. Soc. Symp. Series Vol.407, 220 (1990).Google Scholar
Hayashi, N., Tadano, K., Tanaka, T., Shiraishi, H., Ueno, T., Iwayanagi, T.: Jpn. J. Appl. Phys., Part 1 Vol.29(11),2632 (1990)Google Scholar
[6] Brinker, C.J., Scherer, G.W.: Sol-Gel Science, Academic Press, Inc., New York 1990.Google Scholar
[7] Popall, M., Meyer, H., Schmidt, H. and Schulz, J., Mat. Res. Soc. Symp. Proc. 180, 995 (1990).CrossRefGoogle Scholar
[8] Popall, M., Meyer, H. and Schulz, J., MICRO SYSTEM TECHNOLOGIES 90, Reichl, H. (Ed.), Springer-Verlag, Berlin, 297 (1990).Google Scholar
[9] Popall, M. and Schulz, J., Proceedings ELMAT 91 - Materials in Micro Electronics, Hieber, H. (Ed.), VDE-Verlag, Berlin, 1 (1991).Google Scholar