Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-29T07:40:38.918Z Has data issue: false hasContentIssue false
  • English
  • Français

Nanoindentation of Epitaxial Films: A Study of Pop-in Events

Published online by Cambridge University Press:  21 February 2011

A. B. Mann ,
J. B. Pethica ,
W. D. Nix  and
S. Tomiya
A. B. Mann
Affiliation:
Oxford University, Dept. of Materials, Oxford, OX1 3PH, UK.
J. B. Pethica
Affiliation:
Oxford University, Dept. of Materials, Oxford, OX1 3PH, UK.
W. D. Nix
Affiliation:
Stanford University, Dept. of Materials Science & Engineering, Stanford, CA 94305, USA.
S. Tomiya
Affiliation:
Sony Research Centre, 174 Fujitsuka-cho, Hodogaya-ku, Yokohama 240, Japan
Get access

Abstract

Discontinuities in nanoindentation loading curves are frequently observed in ceramic materials. These normally occur at fairly random loads and displacements, probably due to the random distance of pre-existing defects from the indent location. Here we report the observation of reproducible, sudden indent-depth changes which occur over a very narrow distribution of depths and loads, for GaAs and a range of related epitaxial layer systems. The surface preparation and material defect density have a significant influence. Different tip geometries have been used to gain insights into the deformation processes which cause these discontinuities.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 271
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[I] Page, T.F., Oliver, W.C., McHargue, C.J., J. Mater. Res. 7, 450, (1992).Google Scholar
[2] Venkataraman, S.K., Kohlstedt, D.L., Gerberich, W.W., J. Mater. Res. 8, 685 (1993).Google Scholar
[3] Venkataraman, S.K., Huang, H.E., Kohlstedt, D.L., Gerberich, W.W. in Thin Films: Stresses & Mechanical Properties, edited by P.H. Townsend, T.P. Weihs, J.E. Sanchez (Jr.), and P. Borgesen (Mater. Res. Soc. Symp. Proc. 308, 1993) p. 543.Google Scholar
[4] Oliver, W.C., Pharr, G.M., Mater, J.. Res. 7, 1564 (1992).Google Scholar
[5] Pethica, J.B. and Oliver, W.C. in Thin Films: Stresses & Mechanical Properties, edited by J.C. Bravman, W.D. Nix, D.M. Barnett, and D.A. Smith (Mater. Res. Soc. Symp. Proc. 130, 1989) p. 13.Google Scholar
[6] Hainsworth, S.V., Page, T.F., J. Mater. Sci. 29, 5529 (1994).Google Scholar
[7] Gerberich, W.W., Venkataraman, S.K., Huang, H.E., Harvey, S.E., Kohlstedt, D.L., Acta. Metall. Accepted 1994.Google Scholar
[8] Oliver, W.C., MRS Bulletin Sept/Oct 1986. 15.Google Scholar
[9] Johnson, K.L., Contact Mechanics, 1st Ed. (Cambridge University Press, 1985), pp. 45–106.Google Scholar
[10] Johnson, K.L., Kendall, K., Roberts, A.D., Proc. Roy. Soc. Lond. A 324, 301 (1971).Google Scholar
[11] Lawn, B.R., Fracture of Brittle Solids, 2nd Ed. (Cambridge University Press, 1993), pp. 120–127.Google Scholar