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Interfacial Studies on Cr and Ti Deposited on Benzocyclobutene (BCB) Film

Published online by Cambridge University Press:  25 February 2011

Kyung W. Paik  and
Herbert S. Cole
Kyung W. Paik
Affiliation:
GE Corporate Research and Development, P.O.Box 8, Schenectady, NY 12301
Herbert S. Cole
Affiliation:
GE Corporate Research and Development, P.O.Box 8, Schenectady, NY 12301
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Abstract

Interfacial characteristics such as chemical reaction, metal diffusion, and morphology were investigated for Cr/BCB and Ti/BCB structures. Using Auger and XPS depth profiling, the formation of Ti carbide and Cr oxide was confirmed at the metal/BCB interface. Annealing at 250 °C for extended time periods resulted in diffusion of Cr and Ti into the BCB and subsequent formation of CrSi2 and Ti-Si compound precipitates. The reaction is a thermal diffusion controlled process which was dependent on time and temperature. It was also found that Ar backsputtering treatment on BCB film before metallization was found to roughen the surface resulting in metal spikes which penetrate into the BCB film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 309
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. Jensen, R.J., Mat. Res. Soc. Proc. Vol. 108, 73. (1988)Google Scholar
2. Jensen, R.J. and Lai, J.H., in Polymers for Electronic Application, edited by Lai, J.H., (1989, CRC press), p. 33 Google Scholar
3. Soane, D.S. and Martynenko, Z., Polymers for Microelectronic, (1989, Elsevier), p. 153 Google Scholar
4. Bakoglu, H.B., Circuit. Interconnections, and Packaging for VLSI, (1990, Addison Wesley), p. 81 Google Scholar
5. Hahn, S.F., Townsend, P.H., Burdeaux, D.C., and Gilpin, J.A., “The Fabrication and Properties of Thermoset Films Derived from Bisbenzocyclobutene for Multilayer Applications”, Technical Report from Dow Chemical Co.,(1988).Google Scholar
6. Townsend, P.H., Burdeaux, D.C., Hahn, S.F., Thomsen, M., McGee, R., Carr, J.N., Johnson, R.W., and Weidner, K., ISHM '89 Proceedings, Baltimore, MD, 447, (1989)Google Scholar
7. Kim, J., Kowalczyk, S.P., Kim, Y.H., Chou, N.J. and Oh, T.S., Mat. Res. Soc. Symp. Proc. Vol. 167, 137, (1989)Google Scholar
8. Ohuchi, F.S. and Freilich, S.C., J. Vac. Sci. Technol., A 6(3), 1004, (1988)Google Scholar