Hostname: page-component-7bb8b95d7b-s9k8s Total loading time: 0 Render date: 2024-09-11T22:43:06.828Z Has data issue: false hasContentIssue false

Interface Reactions and Electrical Behaviour of Ni-AuGe Contacts on GaAs

Published online by Cambridge University Press:  26 February 2011

A P Botha
Affiliation:
National Institute for Materials Research, CSIR, PO Box 395, Pretoria, OOOl, South Africa
E Relling
Affiliation:
National Institute for Materials Research, CSIR, PO Box 395, Pretoria, OOOl, South Africa
Get access

Abstract

Interdiffusion and reaction in the GaAs/AuGe/Ni and GaAs/Ni/AuGe/Ni thin film systems have been investigated, using Auger Electron Spectroscopy depth profiling and Rutherford Backscattering Spectrometry. The roles of the individual metal layers were determined by studying the GaAs/AuGe, GaAs/Ni and GaAs/Ni/AuGe subsystems. It was found that the interfacial layer in the GaAs/Ni/AuGe/Ni contact scheme prevents Ge from diffusing away from the interface. In this way more efficient doping of the GaAe is possible. Current-Voltage measurements indicate that this layer structure forms a good ohmic contact to GaAs.

Type
Research Article
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Rideout, V.L., Solid State Electronics, 18, 541 (1975).Google Scholar
2. Robinson, G.Y, Solid State Electronics, 18, 331 (1975).Google Scholar
3. Robinson, G.Y, Thin Solid Films, 72, 129 (1980).Google Scholar
4. Iliadis, A. and Singer, K.E., Solid State Electronics, 26, 7 (1983).Google Scholar
5. Gyulai, J., Mayer, J.W., Rodriques, V., Yu, A.Y.C. and Gopen, H.J., J. Appl. Phys., 42, 3578 (1971).Google Scholar
6. Rai, A.K., Bhattacharya, R.S. and Park, Y.S., Thin Solid films, 114, 398 (1984).Google Scholar
7. Breslau, N., J. Vac. Sci. Technol., 19, 803 (1981).Google Scholar
8. Kuan, T.S., Batson, P.E., Jackson, T.N., Rupprecht, H. and Wilkie, E.L., J. Appl. Phys., 54, 6952 (1983).Google Scholar
9. Ogawa, M., J. Appl. Phys., 51, 406 (1980).Google Scholar
10. Jung, T.H. and Nebauer, E., Phys. Sol. (a) 77, K203 (1983).Google Scholar
11. Marlow, G.S., Das, M.B. and Tongson, L., Solid State Electronics, 261, 259 (1983).Google Scholar
12. Allen, D.A. and Thorp, S.C., Physica, 129B, 445 (1985).Google Scholar
13. Fathy, D., Krivanek, O.L. and Spence, J.C.H., MRS Symp. Proc, 25, 557 (1984).Google Scholar
14. Hansen, M., Constitution of Binary Alloys, 2nd edition (McGraw-Hill, New York, (1958) p. 206.Google Scholar
15. Wittmer, M., Pretorius, R., Mayer, J.W. and Nicolet, M-A., Solid State Electronics, 20, 433 (1977).Google Scholar
16. Ogawa, M., Thin Solid films, 70, 181 (1980).Google Scholar
17. Relling, E. and Botha, A.P. (unpublished).Google Scholar