Hostname: page-component-848d4c4894-nmvwc Total loading time: 0 Render date: 2024-07-07T23:32:48.459Z Has data issue: false hasContentIssue false

Inorganic-Organic Composites (Ormocers) as Structured Layers for Microelectronics

Published online by Cambridge University Press:  28 February 2011

Michael Popall
Affiliation:
Fraunhofer-Institut für Silicatforschung,Neunerplatz 2,D-8700 Würzburg,F.R.G.
Henning Meyer
Affiliation:
Fraunhofer-Institut für Silicatforschung,Neunerplatz 2,D-8700 Würzburg,F.R.G.
Helmut Schmidt
Affiliation:
Institut für Neue Materialien der Universität Saarbrücken,Im Stadtwald,Gebäude 43,D-6600 Saarbrücken,F.R.G.
Jochen Schulz
Affiliation:
Fraunhofer-Institut für Silicatforschung,Neunerplatz 2,D-8700 Würzburg,F.R.G.
Get access

Abstract

Enhanced integration, faster signal transmission and reduced size of mounting devices in components for microelectronics requires new patternable materials. Inorganic-organic copolymers (ORMOCERs = ORganically MOdified CERamics), prepared by sol-gel techniques have been developed for interconnection technologies in microelectronics. Photopolymerization is enabled by unsaturated hydrocarbon or epoxide substituents and UV-sensitive initiators. Using a frequency doubled Argonion laser at 257 nm for direct laser writing, patterned layers with high edge quality have been realized. In combination with high breakthrough voltages, low permittivity constants and high bulk resistivities they open interesting aspects for very large system integration techniques (VLSI).

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Terasawa, M., Minami, S. and Rubin, J., Proceedings of ISHM Symposium on Microelectronics, 607 – 615 (1983).Google Scholar
1a Neugebauer, C. A. and Carlson, R. O., IEEE Transactions on Components, Hybrids and Manufacturing Technology, 10 (2), 184 – 189 (1987).Google Scholar
1b Lin, Y. S., Cole, H.S. in: Electronic Packaging Materials, Materials Science IV, eds. R. Jaccodine, K. A. Jackson, E. D. Lillie, R. C. Sundahl, MRS Vol. 154, Pittsburg 11 (1989).Google Scholar
[2] Plastics for Electronics, ed. Goosey, M. T., Elsevier Applied Science Publishers, London (1985).Google Scholar
[3] Schmidt, H. and Wolter, H., Fifth International Workshop on Glasses and Ceramics from Gels, Rio de Janeiro 1989).Google Scholar
[4] Schmidt, H., Popall, M. and Schulz, J. in: Proceedings Second International Symposium on New Glass, The Association of New Glass Industries Tokyo, 134 – 135 (1989).Google Scholar
5a Bailey, D. B., Daly, R. C., Brust, T. B. and Pearson, J. M. in: Polymers for Advanced Technologies, IUPAC International Symposium, ed.: Menachem Lewin, Jerusalem, 18 – 33 (1987).Google Scholar
[5] Suzaki, Y., Tachibana, A., Appl. Opt. 14, 2809 (1971).Google Scholar