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Direct observations of the sintering of silver nanoparticles on single crystal copper by in-situ uhv tem

Published online by Cambridge University Press:  10 February 2011

M. Yeadon ,
J. C. Yang ,
R. S. Averback ,
J. W. Bullard  and
J. M. Gibson
M. Yeadon
Affiliation:
Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana IL 61801
J. C. Yang
Affiliation:
Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana IL 61801
R. S. Averback
Affiliation:
Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana IL 61801
J. W. Bullard
Affiliation:
Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana IL 61801
J. M. Gibson
Affiliation:
Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana IL 61801
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Abstract

Using a novel ultrahigh vacuum (UHV) transmission electron microscope with in-situ UHV sputtering attachment we have studied the sintering of copper and silver nanoparticles with single crystal copper substrates. Copper and silver particles deposited on (001) copper initially assume random orientations. Upon annealing, however, the particles reorient and assume an epitaxial orientation with the substrate. In the case of copper on copper, homoepitaxy occurs by a process involving sintering and grain growth. In the case of silver on copper, we have observed the particles to wet the substrate surface and sinter to form a thin epitaxial film with the orientation relationship (111)Ag // (001)Cu, [110]Ag // [110]Cu.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 501: Symposium FF – Surface Controlled Nanoscale Materials for High-Added… , 1997 , 283
Copyright
Copyright © Materials Research Society 1998

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References

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