Hostname: page-component-848d4c4894-xm8r8 Total loading time: 0 Render date: 2024-07-02T20:45:51.514Z Has data issue: false hasContentIssue false

Confinement of Threading Dislocations in Simox with a GeSi Strained Layer

Published online by Cambridge University Press:  28 February 2011

F. Namavar
Affiliation:
Spire Corporation, Patriots Park, Bedford, MA
E. Cortesi
Affiliation:
Spire Corporation, Patriots Park, Bedford, MA
D.L. Perry
Affiliation:
Purdue University, West Lafayette, IN
E.A. Johnson
Affiliation:
Spire Corporation, Patriots Park, Bedford, MA
N.M. Kalkhoran
Affiliation:
Spire Corporation, Patriots Park, Bedford, MA
J.M. Manke
Affiliation:
Spire Corporation, Patriots Park, Bedford, MA
N.H. Karam
Affiliation:
Spire Corporation, Patriots Park, Bedford, MA
R.F. Pinizzotto
Affiliation:
University of North Texas, Denton, TX
H. Yang
Affiliation:
University of North Texas, Denton, TX
Get access

Abstract

We have investigated improving the crystalline quality of epitaxial silicon grown on SIMOX by confining threading dislocations in the original Si top layer using a GeSi strained layer. Epitaxial Si/GeSi/Si structures were grown by CVD on SIMOX and Si substrates with a GeSi alloy layer about 1000 − 1500 angstroms thick with Ge concentrations of about 0−20%. A Ge concentration in the alloy layer of about 5.5% or higher appears to be necessary in order to bend any of the threading dislocations from the original SIMOX top layer. For a higher Ge concentration of about 16%, most of the threading dislocations appear to be bent and confined by the GeSi layer. In addition, the GeSi strained layers grown by CVD (at about 1000°C) appear to be high quality and no misfit dislocations were observed in the regions studied by XTEM and plane view TEM.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tsaur, B.Y., Mat. Res. Soc. Symp. Proc. 35, 641 (1985).Google Scholar
2. Celler, G.K., Hemment, P.L.F., West, K.W., and Gibson, J.M., Appl. Phys. Lett. 48, 532 (1986).Google Scholar
3. Mao, B.Y., Chang, P.H., Lam, H.W., Shen, B.W., and Keenan, J.A., Appl. Phys. Lett. 48, 794 (1986).10.1063/1.96672Google Scholar
4. Hill, D., Fraundorf, P., and Fraundorf, G., J. Appl. Phys. 63, 4932 (1988).10.1063/1.340436Google Scholar
5. Cheek, T.F. Jr., and Chen, D., Mat. Res. Soc. Symp. Proc. 107, 53 (1988).10.1557/PROC-107-53Google Scholar
6. Margail, J., Stoemenos, J., Jaussaud, C., and Bruel, M., Appl. Phys. Lett. 54, 526 (1989).Google Scholar
7. Namavar, F., Cortesi, E., and Sioshansi, P., in Selected Topics in Electronic Materials, edited by Appleton, B.R. et al. , (Mat. Res. Soc. Extended Abstracts, Pittsburgh, PA 1988), 109.Google Scholar
8. Namavar, F., Cortesi, E., and Sioshansi, P., Mat. Res. Soc. Symp. Proc. 128, 623 (1989).Google Scholar
9. Cullen, G.W. and Duffy, M.T., IEEE SOS/SOI Technology Workshop, 6-8 October 1987, Durango, CO.Google Scholar
10.Private Communication (August 1989) with Brandewie, J., Rockwell International.Google Scholar
11. Buchanan, B.L., Neamen, D.A., and Shedd, W.M., IEEE Trans. Electron Devices ED–25, 959 (1978).Google Scholar
12. Buchanan, B.L., in VLSI Handbook, edited by Einspruch, N.G. (Academic Press, Inc., Orlando, FL, 1985), 571.Google Scholar
13. Davis, G.E., Hite, L.R., Blake, T.G.W., Chen, C.-E., Lam, H.W., and DeMoyer, R. Jr., IEEE Trans. Nucl. Sci. NS–32, 4432 (1986).Google Scholar
14. Worley, E., Brandewie, J., and Elkins, P., IEEE SOS/SOI Technology Conference, Stateline, NV, 3-5 October 1989.Google Scholar
15. Namavar, F., Buchanan, B., Cortesi, E., and Sioshansi, P., Mat. Res. Soc. Symp. Proc. 147, 235 (1989).Google Scholar