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A Comparative Study on the Activation Behavior of Implanted Boron and Phosphorus for LTPS Using Solid-Phase Crystallization
Published online by Cambridge University Press: 30 July 2012
Abstract
This work presents a study on the activation behavior of high-dose (φ > 1015 cm-2) boron and phosphorus implants for low resistance source and drain regions for thin-film transistors (TFTs) fabricated using solid-phase crystallization (SPC) of amorphous silicon. Process variables include factors associated with ion implant and annealing conditions, as well as the SPC and implant process arrangement. Four-point probe sheet resistance (Rs) measurements were used as a comprehensive assessment of the electrical properties. Results have identified similarities and differences in activation behavior that can influence process integration strategies considering both the SPC approach and TFT fabrication.
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- Copyright © Materials Research Society 2012
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