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Blister Test Analysis Methods

Published online by Cambridge University Press:  21 February 2011

Robert J Hohlfelder ,
Joost J. Vlassak ,
William D. Nix ,
Huihong Luo  and
Christopher E.D. Chidsey
Robert J Hohlfelder
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
Joost J. Vlassak
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
William D. Nix
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford CA 94305
Huihong Luo
Affiliation:
Department of Chemistry, Stanford University, Stanford, CA 94305.
Christopher E.D. Chidsey
Affiliation:
Department of Chemistry, Stanford University, Stanford, CA 94305.
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Abstract

We present a general mathematical model of the blister test describing the relation between adhesion energy and other test parameters, and discuss the assumptions made therein. We describe the effects of excessive compliance in the blister test apparatus and discuss the design of our apparatus. Preliminary results from adhesion tests of polymer films which use self-assembled monolayers as adhesion promoters are presented. Some features of the data can be explained by a simple model incorporating a rate-dependent adhesion energy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 585
Copyright
Copyright © Materials Research Society 1995

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