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Annealing Effects on Si Nanocrystal Nonvolatile Memories

Published online by Cambridge University Press:  01 February 2011

Panagiotis Dimitrakis
Affiliation:
[email protected], NCSR Demokritos, Institute of Microelectronics, Ag.Paraskevi, Greece
Caroline Bonafos
Affiliation:
[email protected], CEMES-CNRS, 29 rue Jeanne Marvig, TOULOUSE, 31400, France, 0562257911, 0562257999
Sylvie Schamm
Affiliation:
[email protected], CEMES-CNRS, 29 rue Jeanne Marvig, TOULOUSE, 31400, France, 0562257911, 0562257999
Pascal Normand
Affiliation:
[email protected], NCSR, IMEL, Aghia Paraskevi, Greece
G. Ben Assayag
Affiliation:
[email protected], CEMES, CNRS, Toulouse, France
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Abstract

The effect of thermal treatments in oxidizing ambient on the structural and electrical properties of low-energy Si-implanted thin SiO2 layers which previously suffered or not high temperature annealing in inert ambient was investigated. Based on TEM examination, charge trapping evaluation and FN conduction analysis of the resulting Si-NC SiO2 matrices, a model taking into account the healing of excess silicon atoms introduced by implantation and the generation of Si interstitials by oxidation above and below the viscoelastic temperature of SiO2 is proposed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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