No CrossRef data available.
Article contents
Low-k Dielectric Integration Cost Modeling
Published online by Cambridge University Press: 15 February 2011
Abstract
The wide variety of low-k dielectric materials and processes for ULSI interconnection were sorted to create generic process flows. Average material and equipment costs were then used as inputs to a generic cost-per-wafer (CPW) model for dielectric deposition (not including the costs of dielectric CMP, metallization, or lithography). The model outputs are internally consistent, and useful for comparison of similar processes.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1997