Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Cook, Lee M.
1999.
Chemical Mechanical Polishing in Silicon Processing.
Vol. 63,
Issue. ,
p.
155.
Kye Weon Kim
Yu Sin Yang
Chung Sam Chun
Sang Mun Chun
Dong Chun Lee
Sun Yong Choi
Sang Bong Choi
and
Sung Jin Park
2001.
Development of the inspection system of defects on a CMP (Chemical Mechanical Polishing) pad.
p.
415.
Lu, H
Fookes, B
Obeng, Y
Machinski, S
and
Richardson, K.A
2002.
Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces.
Materials Characterization,
Vol. 49,
Issue. 1,
p.
35.
Wang, Chih-Cheng
Lin, Shih-Chieh
and
Hochen, Hong
2002.
A material removal model for polishing glass–ceramic and aluminum magnesium storage disks.
International Journal of Machine Tools and Manufacture,
Vol. 42,
Issue. 8,
p.
979.
Zhou, Chunhong
Shan, Lei
Hight, J. Robert
Danyluk, Steven
Ng, S. H.
and
Paszkowski, Andrew J.
2002.
Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO2Chemical Mechanical Polishing.
Tribology Transactions,
Vol. 45,
Issue. 2,
p.
232.
Lin, Shih-Chieh
and
Wu, Meng-Long
2002.
A study of the effects of polishing parameters on material removal rate and non-uniformity.
International Journal of Machine Tools and Manufacture,
Vol. 42,
Issue. 1,
p.
99.
Lu, H.
Obeng, Y.
and
Richardson, K.A.
2002.
Applicability of dynamic mechanical analysis for CMP polyurethane pad studies.
Materials Characterization,
Vol. 49,
Issue. 2,
p.
177.
Hooper, B.J
Byrne, G
and
Galligan, S
2002.
Pad conditioning in chemical mechanical polishing.
Journal of Materials Processing Technology,
Vol. 123,
Issue. 1,
p.
107.
Gharbia, Yousef A
and
Katupitiya, Jayantha
2003.
Loose abrasive blasting as an alternative to slurry polishing of optical fibre end faces.
International Journal of Machine Tools and Manufacture,
Vol. 43,
Issue. 14,
p.
1413.
Evans, C.J.
Paul, E.
Dornfeld, D.
Lucca, D.A.
Byrne, G.
Tricard, M.
Klocke, F.
Dambon, O.
and
Mullany, B.A.
2003.
Material Removal Mechanisms in Lapping and Polishing.
CIRP Annals,
Vol. 52,
Issue. 2,
p.
611.
McGrath, John
and
Davis, Chris
2004.
Polishing pad surface characterisation in chemical mechanical planarisation.
Journal of Materials Processing Technology,
Vol. 153-154,
Issue. ,
p.
666.
James, David B.
2004.
Chemical-Mechanical Planarization of Semiconductor Materials.
Vol. 69,
Issue. ,
p.
167.
Ng, D
Kulkarni, M
Xu, G
Severs, P
Marvin, R
Xiao, J
and
Liang, H
2005.
Understanding Polymeric Pads in Pre-CMP Conditioning.
Journal of ASTM International,
Vol. 2,
Issue. 5,
p.
1.
Zantye, Parshuram B.
Mudhivarthi, S.
Kumar, Ashok
and
Obeng, Yaw
2005.
Metrology and characterization of application specific chemical mechanical polishing pads.
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films,
Vol. 23,
Issue. 5,
p.
1392.
Zeng, T.
and
Sun, T.
2005.
Size Effect of Nanoparticles in Chemical Mechanical Polishing—A Transient Model.
IEEE Transactions on Semiconductor Manufacturing,
Vol. 18,
Issue. 4,
p.
655.
Wiegand, Susanne
and
Stoyan, Dietrich
2006.
Stochastic Models for Pad Structure and Pad Conditioning Used in Chemical-Mechanical Polishing.
Journal of Engineering Mathematics,
Vol. 54,
Issue. 4,
p.
333.
Ul-hasan, Iftikhar
and
Geer, Robert
2007.
Spectroscopic and Topographic Investigations of Nanoparticle Abrasive retention in Polyurethane CMP Pads for Cu CMP.
MRS Proceedings,
Vol. 991,
Issue. ,
Qin, N.
Guo, Dong Ming
Kang, Ren Ke
and
Huo, Feng Wei
2008.
Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization.
Key Engineering Materials,
Vol. 389-390,
Issue. ,
p.
498.
Belkhir, N.
Bouzid, D.
and
Herold, V.
2009.
Determination of the Friction Coefficient During Glass Polishing.
Tribology Letters,
Vol. 33,
Issue. 1,
p.
55.
Yeruva, Suresh B.
Park, Chang-Won
Rabinovich, Yakov I.
and
Moudgil, Brij M.
2009.
Impact of Pad–Wafer Contact Area in Chemical Mechanical Polishing.
Journal of The Electrochemical Society,
Vol. 156,
Issue. 10,
p.
D408.