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Ceramics and Glass-Ceramics in Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

Rao R. Tummala
Rao R. Tummala*
Affiliation:
IBM Corporation, East Fishkill, New York, 12533
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Abstract

An overview of ceramic packaging as it evolved over the last two decades from dual-in-line packages to state-of-the-art multilayer multichip packages ispresented. IBM's 69 layer glass-ceramic/copper multilayer multichip substrate with dielectric constant of 5.0, thermal expansion exactly matching silicon and exceptional dimensional control is summarized.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 203
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. Tummala, R. R., Microelectronics Packaging Handbook, Van Nostrand Reinhold, NY, 1989 Google Scholar
2. Tummala, R. R., Knickerbocker, J. U., “The Glass-Ceramic/Copper Multilayer Substrate: A New Generation of High Performance Multilayer Ceramic Substrate for 1990's”, IBM, J. Res. Dev., Sept., 1991 Google Scholar
3. Tummala, R. R., “Advanced Packaging in 1990's - A Perspective from America”, to be published in IEEE Trans. CHMT, 1991.Google Scholar
4. Kamehana, N., Niwa, K. and Murakawa, K., “Packaging Material for High Speed Computers.” 33rd Electronic Components Conference Proceedings, pp. 338–392, 1983.Google Scholar