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A New Generation Plasma FIB Column with Higher Probe Current and Improved Imaging Resolution

Published online by Cambridge University Press:  30 July 2020

Tomáš Hrnčíř ,
Dušan Nešpor ,
Zsolt Radi ,
Jaroslav Jiruše ,
Lukáš Hladík ,
Olivier Salord  and
Anne Delobbe
Tomáš Hrnčíř
Affiliation:
TESCAN Brno s.r.o, Brno, Jihomoravsky kraj, Czech Republic
Dušan Nešpor
Affiliation:
TESCAN Brno s.r.o, Brno, Jihomoravsky kraj, Czech Republic
Zsolt Radi
Affiliation:
TESCAN Brno s.r.o, Brno, Jihomoravsky kraj, Czech Republic
Jaroslav Jiruše
Affiliation:
TESCAN Brno s.r.o, Brno, Jihomoravsky kraj, Czech Republic
Lukáš Hladík
Affiliation:
TESCAN ORSAY HOLDING, a.s., Brno, Jihomoravsky kraj, Czech Republic
Olivier Salord
Affiliation:
Orsay Physics, Fuveau, Provence-Alpes-Cote d'Azur, France
Anne Delobbe
Affiliation:
Orsay Physics, Fuveau, Provence-Alpes-Cote d'Azur, France

Abstract

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Type
FIB-SEM Technology and Electron Tomography for Materials Science and Engineering
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 412 - 413
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Copyright
Copyright © Microscopy Society of America 2020

References

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Altmann, F. et al. ; Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma-FIB Milling; ISTFA: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis (2012), 39.Google Scholar
Hrnčíř, T., Šikula, M. and Oboňa, J. V.; How to achieve artefact-free FIB milling on polyimide packages; ISTFA: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis (2016), 642.Google Scholar
Hrnčíř, T. et al. ; How Xe and Ga FIB differ in inducing lateral damage on TEM samples; ISTFA: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis (2015), 60.Google Scholar
Hrnčíř, T. and Hladík, L.; Fast and Precise 3D Tomography of TSV By Using Xe Plasma FIB; ISTFA: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis (2013), 27.Google Scholar
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Viswanathan, V. et al. ; Precision Xe Plasma FIB Delayering for Physical Failure Analysis of sub-20 nm Microprocessor Devices; ISTFA: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis (2017), 593.Google Scholar
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