Hostname: page-component-78c5997874-ndw9j Total loading time: 0 Render date: 2024-11-03T00:10:02.568Z Has data issue: false hasContentIssue false
  • English
  • Français

Microscopic Analysis of Tin Whisker Growth on Tin Plated Copper Microchip Leads.

Published online by Cambridge University Press:  04 August 2017

A. Rochester ,
D. Burdick  and
H. Aglan
A. Rochester
Affiliation:
Tuskegee University, Tuskegee, AL, USA
D. Burdick
Affiliation:
The Boeing Company, St. Louis, MOUSA
H. Aglan
Affiliation:
Tuskegee University, Tuskegee, AL, USA

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 23 , Supplement S1: Proceedings of Microscopy & Microanalysis 2017 , July 2017 , pp. 1774 - 1775
Copyright
© Microscopy Society of America 2017 

References

[1] Aglan, H, Prayakarao, K, Rahman, M & Burdick, D Engineering 7 2015). p. 816–826.Google Scholar
[2] Shibutani, T, Wu, J, Yu, Q & Pecht, M Microelectronics Reliability 48 2008 1613–1627.Google Scholar
[3] Nakai, K, et al, Journal of Physics: Conference Series 2009). p. 012089.Google Scholar