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Microscopic Analysis of Tin Whisker Growth on Tin Plated Copper Microchip Leads.

Published online by Cambridge University Press:  04 August 2017

A. Rochester ,
D. Burdick  and
H. Aglan
A. Rochester
Affiliation:
Tuskegee University, Tuskegee, AL, USA
D. Burdick
Affiliation:
The Boeing Company, St. Louis, MOUSA
H. Aglan
Affiliation:
Tuskegee University, Tuskegee, AL, USA

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 23 , Supplement S1: Proceedings of Microscopy & Microanalysis 2017 , July 2017 , pp. 1774 - 1775
Copyright
© Microscopy Society of America 2017 

References

[1] Aglan, H, Prayakarao, K, Rahman, M & Burdick, D Engineering 7 2015). p. 816–826.Google Scholar
[2] Shibutani, T, Wu, J, Yu, Q & Pecht, M Microelectronics Reliability 48 2008 1613–1627.Google Scholar
[3] Nakai, K, et al, Journal of Physics: Conference Series 2009). p. 012089.Google Scholar